Teardown overview
TechInsights is tearing down the iPhone 15 Pro to reveal internal innovations, including the new A17 chip fabricated on TSMC's 3nm process. The teardown provides insight into the phone's internal structure and component choices.
Memory and DRAM
TechInsights confirmed the presence of Micron's advanced D1β LPDDR5 DRAM, reported to be the industry's first D1b (or D1β) chip. The DRAM component is located on the iPhone 15 Pro A3101 board, with package marking D8DGH and model MT62F1G64D4AM-031 XT:C, intended for mobile applications.
UWB and other chips
A new ultra-wideband (UWB) transceiver chip was identified. The device reportedly took four years to develop and appears to be part of preparation for integration with Apple's upcoming Vision Pro device.
Image: components on the iPhone 15 Pro memory board.
- NXP NFC Controller & Secure Element SN300
- Apple / Cirrus Logic Audio Amplifier 338500537
- Texas Instruments OLED Display Power Supply TPS6565780
- Kioxia 256GB NAND Flash Memory
- Apple / Cirrus Logic Power Conversion 338500843
Fixed logic board: notable components
- Apple / Carus 5og o0739
- Apple A17 Pro Application Processor APLIV02
- SKhynix 8GB LPDDR5 8G66AK6H-X132
- TI SN201027 USB interface or PMIC
- Broadcom Wireless Charging Receiver CBCM59365
- Apple UWB U2
- Apple / Renesas PMIC 338s00616
- Bosch 6-axis MEMS accelerometer & gyroscope
- STMicroelectronics PMIC STCPM1A3
- STMicroelectronics PMIC STB605A11
- STMicroelectronics PMIC STCPMIA3
- Apple PMIC APL109
- Apple / Cirrus Logic Audio Amplifier
- Apple / Renesas PMIC 33803936-Bo
Rear camera changes
The rear cameras show significant changes compared with previous models. The telephoto camera uses a larger image sensor (CIS) and prism; one module is a periscope-style camera providing 5x optical zoom. This is the first time Apple has used this type of camera in the iPhone lineup.
RF board features
- Wi-Fi & Bluetooth combo module 339s01232
- Qorvo FEM M76305
- Skyworks FEM SKY58440-11
- Qualcomm FR1 RF Transceiver SDR735 x2
- Qualcomm PMIC PMX65-000
- NXP NFC Controller PN60V2
- Skyworks FEM SKY50313??
- Broadcom FEM AFE M-8245
- GPS receiver IC
- USI 5G mmWave FEM 339M00323
- Qualcomm Envelope Tracker QET7100 x2
- Broadcom FEVAFEM-8234
- STMicroelectronics secure MCU / eSIM ST33J
- Qualcomm Snapdragon X70 modem
- Oualcorm ER2 Oorvo APt (likely)
- RF transceiver SMR546
A17 Pro packaging and materials
Preliminary analysis of the Apple A17 Pro (TSMC 3nm) reveals details on the structures and materials used in manufacturing.
Regional memory supplier differences
The U.S. iPhone 15 Pro units examined include SK Hynix memory, while Canadian units include Micron memory. This supplier variation is a notable observation.
Annotated logic board components
- Apple A17 Pro Application Processor APLIV02
- SK hynix 8GB LPDDR5 8G66AK6H-X132
- TI SN201027 USB interface or PMIC
- Broadcom Wireless Charging Receiver CBCM59365
