Overview
The powertrain of modern new energy vehicles consists of multiple subsystems such as the battery, VCU, BSM, and motor. Among these, the motor drive section relies on IGBT (Insulated Gate Bipolar Transistor) chips as the core power semiconductor. Multiple IGBT chips are integrated into a single IGBT module to provide higher power handling and improved thermal performance, making them a critical component in electric powertrains.
What are the "three electrics" and the electric drive system?
The "three electrics" commonly refer to the traction battery (battery), the drive motor (motor), and the motor controller (motor control), which together account for a large portion of a vehicle's cost and determine vehicle propulsion performance. The electric drive system is typically considered to include the motor, the motor controller, and the reduction gearbox.
From a stricter systems perspective, the electric drive system includes three major assemblies: the drive motor assembly (converts battery electrical energy to mechanical rotational energy), the controller assembly (hardware and software based on power semiconductors that control the motor in real time and provide other control functions), and the transmission assembly (gearset that reduces output speed and increases torque so the drive system operates in an efficient range).
Electric drive system operation
During vehicle operation, the motor controller converts DC from the traction battery into AC via inversion to drive the motor. The motor converts electrical energy into mechanical energy, which is delivered to the wheels through the transmission. The reverse process, where kinetic energy is converted back and stored in the battery, is regenerative braking.
How an IGBT module works
Typical IGBT module packages are flat rectangular blocks. The outer housing is usually a plastic case; the base is a thermally conductive metal plate, commonly copper. The module includes multiple terminals and pins for power and control connections.
Within an inverter, the IGBT module is the key power stage. Conceptually, each IGBT die functions as an electronic switch. By arranging multiple IGBT dies in parallel and series within the module and switching them rapidly in different combinations, the module converts DC into the desired AC waveform by controlling current direction and frequency.
IGBT module production process
Manufacturing IGBT modules requires high technical and process standards beyond just chip fabrication. Typical sealed-package IGBT module cross sections are similar across vendors. The main packaging steps include:
- Die placement onto DBC (direct bonded copper) substrates
- Vacuum reflow or soldering to attach dies to DBC
- Ultrasonic cleaning
- X-ray void inspection to detect solder voids that degrade thermal resistance (automotive modules typically require void rates below 1%)
- Wire bonding to connect dies to DBC or terminals, commonly using aluminum wire; copper wire or ribbons are also used
- Static tests and visual inspections; defective modules are rejected
- Soldering and bonding of the DBC to the copper baseplate, followed by potting, encapsulation, and laser marking
- Terminal forming and final functional tests, including dynamic electrical tests, insulation tests, and reverse-bias tests
Common automotive IGBT module package types
- Econodual half-bridge package: mainly used in commercial vehicles; typical ratings include 1200 V / 450 A and 1200 V / 600 A.
- HP1 full-bridge package: used in low- to mid-power passenger vehicles. Peak power generally below 70 kW. Common ratings include 650 V / 400 A; other variants include 750 V / 300 A, 750 V / 400 A, and 750 V / 550 A.
- HPD full-bridge package: used in mid- to high-power vehicles, covering many mainstream models. A common rating is 750 V / 820 A; other variants include 750 V / 550 A.
- DC6 full-bridge package: an integrated UVW three-phase full-bridge packaging solution offering compact layout, high power density, and improved thermal performance.
- TO-247 discrete parallelization: some motor controllers use multiple TO-247 discrete transistors in parallel. Advantages include flexible current scaling and easier parasitic inductance management. Challenges include current sharing among paralleling devices, matching switching events, increased system design complexity, and higher assembly interface count.
IGBT market situation in China
As China's new energy vehicle industry has expanded, the upstream supply chain has advanced toward local substitution and growth. Automotive power modules, including IGBT modules, were historically dominated by vendors such as Infineon, ON Semiconductor, Semikron, and Mitsubishi Electric. However, suppliers in China, including BYD Semiconductor, STARPOWER, CRRC Times Electric, Silan Micro, and Cuizhan Micro, have emerged and now supply domestic automotive demand to varying degrees.
Major automotive IGBT module suppliers
Infineon Technologies
Founded in 1999 as a spin-off of Siemens' semiconductor division. Infineon operates multiple R&D sites and manufacturing facilities worldwide. Main products include microcontrollers, sensors, RF transceivers, radar, discrete and integrated power semiconductors, charging modules, DC-DC converters, IGBTs, and processors for automotive networking.
Customers include major automakers and Tier 1 suppliers.
BYD Semiconductor
Established in 2004, BYD Semiconductor develops power semiconductors, intelligent ICs, sensors, optoelectronic semiconductors, and semiconductor manufacturing services. Its product portfolio targets automotive, energy, industrial, and consumer markets.
Products include power management ICs, MOSFETs, LED drivers, metering ICs, reset ICs, IGBT dies and modules, smart power modules, CMOS image sensors, audio amplifiers, TVS and current sensors.
STArPower (Jiaxing STARPOWER)
Founded in 2005, STArPower focuses on power semiconductor chips and modules, especially IGBT chips and modules. It maintains R&D centers domestically and in Europe and is a leading domestic company in the IGBT field.
Main products: IGBT modules, MOSFET modules.
Renesas Electronics
Renesas supplies microcontrollers, SoC solutions, analog and power devices across automotive, industrial, and consumer markets. The company resulted from consolidation of several legacy semiconductor divisions and provides MCU, analog, and power solutions.
DENSO
DENSO is a global automotive supplier founded in 1949. Its product range covers powertrain components, HVAC systems, body electronics, driver assistance systems, communication products, and automotive semiconductors including IGBTs and motor control solutions.
Fuji Electric
Established in 1923, Fuji Electric offers motor systems, electronic equipment, semiconductors, power generation, and energy management products. The company provides IGBT systems for motor control and automotive power electronics.
Mitsubishi Electric
Mitsubishi Electric supplies heavy electrical systems, industrial automation, power devices, and consumer electronics. Its power device portfolio includes transformers, high-voltage switches, IGBTs, and power modules.
CRRC Times Electric
CRRC Times Electric, part of CRRC, develops high-power semiconductors and power electronics for rail traction and other industries. Its product scope includes IGBTs, bipolar devices, power assemblies, and electric drive systems for new energy vehicles.
Cuizhan Microelectronics
Founded in 2018, Cuizhan designs and manufactures automotive-grade IGBT modules. Its production lines have IATF 16949 certification and supply modules to multiple automakers.
Products include automotive IGBT modules, integrated module solutions, SiC modules, discrete devices, and motor control software and toolchains.
Semikron
Semikron is a global manufacturer of power modules and systems for mid-range power applications. Its product portfolio covers IGBT modules, SiC modules, discrete components, and gate drivers.
ON Semiconductor
ON Semiconductor provides high-efficiency silicon solutions including IGBT and SiC modules, MOSFETs, drivers, and image sensors for automotive electrification and ADAS applications.
ROHM
ROHM supplies a wide range of semiconductors including analog, power devices, IGBTs, and SiC power components for automotive and industrial applications.
Hongwei Technology
Jiangsu Hongwei focuses on power semiconductor devices and modules, including fast recovery diodes, IGBT discrete devices, and power modules for industrial and automotive applications.
STMicroelectronics
STMicroelectronics provides semiconductor solutions across many domains, including integrated circuits, power devices, and IGBTs for automotive and industrial markets.
Zhongke Junxin
Zhongke Junxin develops IGBT and FRD chips and modules, leveraging research collaborations and focusing on power semiconductor R&D and manufacturing.
Jilin Huahong Microelectronics
Jilin Huawei develops and manufactures a broad range of power semiconductor devices including IGBTs, MOSFETs, and discrete components for automotive, power electronics, and industrial control applications.
Toshiba
Toshiba supplies automotive semiconductors including image processors for ADAS, motor drivers, IGBT chips for new energy vehicles, and related power device solutions.
Note: Company descriptions focus on product scope and typical application areas without promotional language.
