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ETC On-Board Units: Chip and Solution Selection

Author : AIVON January 13, 2026

Content

 

Overview

OBU stands for On Board Unit, referring to the in-vehicle electronic tag used in ETC (Electronic Toll Collection) systems. Common commercial names include YueTong ETC, ETC Sutong, and similar. The OBU stores vehicle identification data and is typically mounted on the windshield. It communicates with the RSU (Road Side Unit) at toll plazas via dedicated short-range microwave communication (DSRC). When a vehicle approaches a toll barrier, the RSU recognizes the OBU signal and automatically opens the barrier, completing the toll transaction without requiring the driver to stop and thus improving traffic throughput.

 

RSU and OBU Roles

The RSU is installed on the toll lane gantry and functions as the roadside base station. It typically includes a transceiver, an antenna control board, patch antennas, and an RSU controller board to handle signal and data transmission/reception, modulation/demodulation, encoding/decoding, and encryption/decryption. This article focuses on chip-level and solution selection for the vehicle-mounted OBU.

Typical OBU Architecture

Common OBU architectures use an antenna unit to communicate with the gantry RSU in the 5.8 GHz band. A smartphone can connect to the OBU via Bluetooth in the 2.4 GHz band. A card reader unit connects user cards to the OBU using the 13.56 MHz band.

Key OBU Components

An OBU typically comprises an MCU, RF communication chip or module (5.8 GHz, 2.4 GHz, and Bluetooth), an RFID chip (13.56 MHz reader), a security chip (ESAM), a display, a photovoltaic solar module, batteries, and associated peripherals.

MCU and RF

MCU suppliers include Xiaohua, Nuvoton, Shanghai Beken (BEKEN), and STMicroelectronics. An industry estimate of market share placed Xiaohua at about 40%, Nuvoton about 30%, Shanghai Beken about 20%, and STMicroelectronics about 10%. Other MCU vendors seen in the market include Fuwei (FMSH), Unigroup Guoxin, Jiefa, Qipuwei, Texas Instruments (TI), Nations Technology, Lailins, Hangxin, Zhongkewei, and others. SoC chips that integrate 5.8 GHz RF communication often offer better cost-performance; Shanghai Beken, for example, offers highly integrated SoC solutions that combine RF communication and security functions.

Major RF chip or module vendors include Shanghai Beken, Scyrelli, Shengke, Texas Instruments, Analog Devices, Qualcomm, Microchip, Juxin Integration, Nordic, Yizhaowei, Telink, and Jielian Micro.

RFID and Security

Major RFID chip vendors include NXP, Texas Instruments, STMicroelectronics, Fuwei (FMSH), Zhongkewei, Huada, Nations Technology, Weisheng, Shanghai Feiju, WeilinTong, Kedaoxin Guo, and Jielian Micro. Security chip vendors include Analog Devices, Nations Technology, Hongsi Electronics, Hangxin, and Unigroup Tongxin.

Batteries

Battery manufacturers observed in OBU designs include EVE (EVE Energy), Longsheng, VIMUN, Mottcell, Delip, and others.

 

Case Studies: Component Teardowns

The following sections summarize component-level findings from three OBU teardown examples.

1) ETC Sutong Card (teardown)

ETC Sutong Card (teardown)

 

Brand Model Description
Shanghai Beken (BEKEN) BK5863N Low-power SoC integrating an ARM9 processor, a contactless RF card reader, a 5.8 GHz RF transceiver, solar charging management, audio output, temperature sensor, flash, UART, SPI, I2C, and DES
EVE ER14250 Primary lithium battery, 3.6 V, 1200 mAh
Recovery IFR14200 Rechargeable battery, 3.2 V, 100 mAh
VIMUN SC-4025-9B Photovoltaic solar module
SSESAM08 (silkscreen) ESAM security chip
Buzzer and an LCD screen
Contact mechanical switch, RC sensing, LED, connectors, interfaces, structural parts and fasteners, high-frequency ceramic antenna, etc.

Table 1. Selected components from the ETC Sutong card

2) ETC Sutong (TUNA-C10)

ETC Sutong (TUNA-C10)

 

Brand Model Description
Texas Instruments (TI) M430F5418A 16-bit low-power MCU
Shanghai Beken (BEKEN) BK5863N 5.8 GHz RF transceiver integrating all national-standard ETC RF functions including receive, transmit, and wake-up
VIMUN SC-5520-9A Weak-light amorphous silicon solar battery
FMSH FM1702Q 13.56 MHz contactless card reader chip
SJK Two crystals: 32.768 MHz and 13.560 MHz
MUP Card slot
YGG ITSCOS V10 (silkscreen) ESAM security chip
12832J 000097 (silkscreen) 128x32 LCD display
BAT 1601 (silkscreen) Rechargeable battery
Primary lithium battery
Buzzer
Contact mechanical switch, RC sensing, LED, connectors, interfaces, structural parts and fasteners, high-frequency ceramic antenna, etc.

Table 2. Selected components from the ETC Sutong unit

 

3) ETC YueTong Card (Efsys T103)

ETC YueTong Card (Efsys T103)

 

Brand Model Description
Nuvoton NANO100SD3BN 32-bit low-power MCU (NuMicro Nano100 series). Features ultra-low power, 1.8 V to 3.6 V operation, -40 °C to 85 °C, built-in 12 MHz high-accuracy crystal (1% accuracy), and peripherals including timers, watchdog, RTC, DMA, UART, SPI, I2C, I2S, PWM, 12-bit ADC, 12-bit DAC, and ISO-7816
Shanghai Beken (BEKEN) BK5823 5.8 GHz RF transceiver integrating national-standard ETC RF functions including receive, transmit, and wake-up
MOTTCELL IFR14500 Rechargeable battery, 3.2 V, 400 mAh
VIMUN SC-4324-9 Weak-light amorphous silicon solar cell
Yizhaowei (MUP) YC1021 Multi-mode Bluetooth chip
Nations Technology Z32HCD2S 13.560 MHz contactless card reader chip
Nations Technology Z8HM2 ESAM security chip
Holtek HT7136-1 Power management chip
Puya P25Q40H NOR Flash
Jincai LCD display
SJK Three crystals: 32.768 MHz, 13.560 MHz, and 4.096 MHz
Buzzer
Contact mechanical switch, RC sensing, LED, connectors, interfaces, structural parts and fasteners, high-frequency ceramic antenna, etc.

Table 3. Selected components from the Efsys T103

 

Summary

All three OBU teardowns show anti-tamper designs implemented with contact mechanical switches, and the security chip (ESAM) is mandatory. Devices that read and write bank contactless cards should be treated like POS terminals and therefore require financial-grade security.


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