Teardowns of the iPhone 15 continue. The following summarizes component-level findings and PCB layout details.
Mainboard, front side
Apple's front mainboard PCB contains three Apple-designed chips, Texas Instruments power and controller ICs, and a NAND flash. Key components identified:
- Kioxia K5A4RB6302CA12304: 256 GB NAND flash.
- Apple 338S00537: audio amplifier.
- Texas Instruments LM3567A1: flash controller.
- Texas Instruments TPS65657B0: display power supply controller.
- Apple 338S01026-B1: power management IC.
- Apple 338S00843: audio digital signal processor (DSP).
- NXP Semiconductor: near-field communication (NFC) controller.
Mainboard, rear side
The rear side of the mainboard hosts a larger number of chips and power management devices. Key components identified:
- Apple APL1V02/339S01257 A17 Pro: six-core application processor with six-core GPU; SK hynix H58G66AK6HX132 8 GB LPDDR5 DRAM stack.
- Apple APL109A/338S01022: power management IC.
- STMicroelectronics STCPM1A3: power management IC.
- STMicroelectronics STB605A11: power management IC.
- Apple 338S00946-B0: power management IC.
- Apple 338S00616: power management IC.
- Texas Instruments SN2012017: battery charger.
- Broadcom BCM59365EA1IUBG: wireless charging receiver.
- Apple 338S00739: audio codec.
- Apple 338S00537: audio amplifier.
- Winbond W25Q80DVUXIE: 1 MB serial NOR flash.
- Texas Instruments TPS61280H: battery front-end DC-DC converter.
- Apple 339M00298: ultra-wideband (UWB) module.
- Bosch Sensortec: 6-axis MEMS accelerometer and gyroscope.
Secondary board
Another board houses baseband, RF front-end, and related power management components. Key components identified:
- STMicroelectronics ST33J: secure microcontroller.
- Qualcomm PMX65: power management IC.
- Qualcomm QET7100: broadband envelope tracker.
- Qualcomm clock generator.
- Qualcomm SDX70M Snapdragon X70: modem.
- Qualcomm SDR735: RF transceiver.
- Qualcomm SMR546: RF transceiver.
- Apple 339S01232: WiFi and Bluetooth module.
- Broadcom AFE M-8234: front-end module.
- Skyworks SKY58440-11: front-end module.
- Qorvo QM76305: front-end module.
- Skyworks SKY50313: front-end module.
- Apple 339M00287: front-end module.
- Broadcom AFEM-8245: front-end module.
Summary
Overall, the main chips center on Apple's in-house designs, supplemented by products from Qualcomm, Broadcom, NXP, Texas Instruments, STMicroelectronics, and others.
