What Is a Laser TV?
Technical overview of laser TV: projector types (ALPD, SLPL, blue laser), DLP display chips, and ambient-light-rejecting screens for large-room viewing.
Consumer Electronics
Siri Deep Learning Speech Synthesis Techniques
Technical overview of Siri's speech synthesis: how Apple applies deep learning within a hybrid TTS to predict acoustic targets and concatenation costs for natural voice.
What Is a Cloud Phone and What Does It Do?
Technical overview of cloud phone architecture, use cases, deployment trade-offs and security, emphasizing 5G-enabled cloud compute, remote rendering, and multi-identity.
Apple Patents Suggest iPhone 7 Water Resistance
US patent filings reveal Apple patents for a water-resistant interface system, including sealed buttons and speakers with potential application to iPhone devices.
E-cigarette Structure and System Design
Technical overview of e-cigarette system design, atomizer operation and ultrasonic atomization, CSU8RP3125 control-chip safety features and battery charging protection.
E-ink displays: principles, advantages and drawbacks
Explains E-ink electrophoretic display principles, bistability and hysteresis, plus advantages, limitations (low refresh, ghosting), color challenges and applications.
Digital Camcorder Design Using TMS320DM270
Technical overview of a camcorder reference design using TI TMS320DM270 DM270, detailing video capture, MPEG-4/JPEG compression, CCD interface, OSD and storage support.
Tablet Reference Designs for Active and Passive Components
Technical overview of tablet reference designs covering ESD protection, antennas, IR, MCU (Nuvoton NANO100), USB controllers and MEMS clocking components.
Single-Button Power and Reset Design for Smartphones
Explains hardware reset design for smartphones with built-in batteries, detailing PMU/AP power on/off behavior, PS_HOLD timing, and single-key power/reset constraints.
Fan-Out Packaging for Smartphone SoCs
Yole analysts review fan-out packaging for smartphone APUs: performance benefits, cost trends, supplier landscape (TSMC, Samsung), and integration paths for SoCs.
Which chips power the iPhone 15?
Technical teardown of the iPhone 15 Pro Max PCB layout and key chips, focusing on the A17 Pro 3 nm processor, RF PCB architecture and major RF front-end modules.
iPhone 15 Pro teardown: key hardware changes
iPhone 15 Pro teardown by TechInsights details A17 Pro (TSMC 3nm) packaging, Micron D1β LPDDR5 memory, UWB transceiver, camera and RF component choices.
