High Layer Count FR4 PCB Production Record #FR4-20260511-083

This production record covers thirty 10-layer impedance controlled PCBs built on FR4 with a custom stackup. Boards measured 104.1 × 76.2 mm at 1.6 mm thickness, using 1 oz copper throughout, 5/5 mil minimum trace and spacing, and 0.2 mm minimum hole size. We applied blue soldermask, white silkscreen, and HASL Lead Free finish. The combination of tighter geometry on a ten-layer construction without blind vias required exact trace width compensation and stackup modeling to maintain the specified impedance values.

Engineering review, inner layer imaging, circuit etching, and high-pressure lamination were sequenced to ensure layer registration across the multilayer stack. After solder mask application, molten solder coating, and hot air leveling, each board underwent TDR impedance testing followed by full electrical testing. All thirty boards met the impedance targets and passed continuity checks. The complete manufacturing cycle took five days and delivered consistent dimensional and electrical results matching the custom parameters.