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00:44
Decode PCB Markings Video: Read R1 C2 U1 Fast
This one-minute AIVON short explains how to decode PCB silkscreen reference designators printed next to components on a finished board. It introduces common prefixes such as R for resistors, C for capacitors, L for inductors, D for diodes and LEDs, U for ICs, Q for transistors or MOSFETs, F for fuses, FB for ferrite beads, SW for switches, J for connectors, TP for test points, and Y for crystals or oscillators. The video shows how identifiers such as R1 and C2 help engineers match components to the BOM, navigate populated FR4 PCBs, support PCB prototyping and turnkey PCB assembly, and troubleshoot first articles. Clear reference markings also reduce polarity mistakes, simplify testing, and keep assembly documentation aligned with the physical board.
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00:54
Positive vs. Negative PCB Processing: How Circuits Are Formed
This video explains how finished copper circuitry is formed from a copper-clad panel using the two primary PCB fabrication routes: positive processing and negative processing. It compares the complete manufacturing sequences, showing how positive processing uses plated copper and tin as an etch resist for outer-layer pattern plating, while negative processing protects the circuit pattern and etches away unwanted copper, making it widely used for many inner layers. The video highlights why this process choice is a DFM consideration rather than simply a layout preference, as stack-up, copper weight, minimum trace and spacing, and plated-hole requirements all influence the appropriate method. These principles are especially relevant to multilayer FR4 PCB, HDI PCB, and PCB prototype production, where process selection directly affects etch accuracy, plating thickness, yield, and manufacturing reliability.
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00:56
PCB Tombstoning: Causes and Prevention in SMT Assembly
This video explains why SMT tombstoning occurs during reflow, showing how unbalanced solder forces can cause one end of a chip resistor, capacitor, or small inductor to lift while the other remains soldered. Rather than simply blaming the reflow oven, the video identifies two major causes: uneven solder paste deposition caused by stencil aperture, printing, or registration variations, and differences in copper-connected area that make otherwise identical pads heat and wet at different rates. Engineers should therefore verify pad symmetry, copper balance, stencil apertures, paste volume, and placement accuracy during DFM review. These preventive checks are essential for reducing tombstoning in FR4 PCB prototypes and turnkey PCB assembly, particularly for dense consumer electronics, automotive, and industrial control boards.
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00:54
Via Tenting vs Resin Plugging: When Do You Need Resin Filling for Via-in-Pad Designs?
This video explains the practical difference between PCB via tenting and resin plugging, focusing on when each process is appropriate. Via tenting covers the via opening with solder mask, while resin plugging fills the plated via barrel with epoxy resin before curing and planarization. The video highlights Via-in-Pad (VIP) as the key application, particularly for dense BGA and CSP layouts where open vias can wick molten solder away from the joint during reflow. It also clarifies that not every via near a BGA requires resin filling—vias outside solder pads may only need standard tenting or an open treatment. Understanding these options helps engineers avoid unnecessary processing costs while preventing soldering defects in HDI, multilayer, and PCB assembly applications.
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00:59
PCB Rounded Corners: Stop Cracking with Radius
Sharp 90° PCB corners can create stress concentrations that increase the risk of cracking, chipping, and edge damage during depaneling, handling, and assembly. This video explains how adding rounded corners with an appropriate radius can distribute mechanical stress and improve board durability. It covers practical radius recommendations for different board sizes, the impact of radius selection on available board space, and the importance of matching the design to CNC routing capabilities. The video also highlights proper clearance between board edges and copper, traces, or components. These simple mechanical design practices help improve manufacturing reliability across FR4, industrial control, and consumer electronics PCB applications.
