| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Layer Count | Through-Hole board: 1~68-layer HDI: (8+N+8) Standard Stack Up |
The number of copper layers |  |
| Overall Board Thickness (L) | 0.2-10mm | -%E6%9D%BF%E5%8E%9A_%E4%B8%BB%E7%94%BB%E6%9D%BF%401x-compress.webp) |
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| Board Thickness Tolerance (l) | D<1.0mm: ±0.1mm D≥1.0mm: ±10% |
For example, for a nominal board thickness of 1.6 mm, the finished board thickness tolerance ranges from 1.44 mm (T‑1.6×10%) to 1.76 mm (T+1.6×10%). | |
| Max. Dimensions | 1400 X 610mm | ① These limits apply to PCBs with thickness ≥ 0.8 mm. For thinner boards, the maximum dimension is ≤ 510 × 410 mm. ② Max dimension for 2‑layer: ≤ 530 × 700 mm; 4‑layer: ≤ 490 × 590 mm; 6‑layer and above: ≤ 490 × 590 mm. ③ A technical review is required for sizes exceeding the above limits. |
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| Min. Dimensions | 5 X 5mm | These limits apply to PCBs with thickness ≥ 0.6 mm. Thinner PCBs require manual review. Panelization is recommended for small‑size boards. | |
| Min. Core Thickness | 0.05mm | The core thickness for inner layers of these multi‑layer PCBs |  |
| Copper Thickness | Inner Layer: 1/4OZ ~ 15OZ | ① 1oz: The most common and standard copper thickness in the PCB industry. Suitable for most consumer electronics and general‑purpose signal transmission, balancing performance and cost. ② 2‑6oz: Falls into heavy‑copper category. Mainly used for power modules, motor driver boards, high‑current traces, and power devices requiring good heat dissipation. ③ 7‑15oz: Ultra‑heavy copper. This specification is mostly applied in scenarios with extremely high current or demanding heat‑dissipation requirements, such as electric vehicles and industrial controllers. |
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| Outer Layer: 1/2OZ ~ 30OZ | ①1/2 oz and even thinner: Mainly used for inner layers of HDI boards, fine signal traces or high‑frequency circuits. ② 1oz (approx. 35 μm): The mainstream choice for inner layers of standard multi‑layer PCBs, applicable to 90% of conventional designs. ③ 30oz: This is an extremely rare extreme copper thickness.If inner layers need to carry extremely high current or serve as extreme heat‑dissipation / conductive layers, the Embedded Copper Coin process or multiple heavy‑copper electroplating is normally adopted instead. |
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| Warpage Degree | Standard: Plated Through-Hole (PTH) board, ≤1.5%; SMT board, ≤0.75%; Limit: Plated Through-Hole(PTH) board, ≤1.0%; SMT board, ≤0.5% |
Default settings follow standard specifications. A technical review is required if you need limit‑parameter control. Please specify this clearly when placing your order. | |
| Impedance Tolerance | Standard: <50Ω, ±5Ω； ≥50Ω, ±10%； Limit: <50Ω, ±3.5Ω; ≥50Ω, ±8% |
Default settings follow standard specifications. A technical review is required if you need limit‑parameter control. Please specify this clearly when placing your order. | |
| Solder Mask Color | Green, Purple, Red, Yellow, Blue, Cool White, Warm White, High-Reflective White, Black, Matte Black, Matte Green. |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Min. Mechanical Drill (CNC) | 0.1mm | ① For hole size ≥ 6.5 mm, hole tolerance is ±0.1 mm or wider. CNC routing is adopted for holes of 6.5 mm and above. ② Holes ≤ 0.2 mm with an aspect ratio ≥ 10 are classified as medium‑difficulty requirements. |
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| Aspect Ratio(Rate of finished board thickness to min plated hole diameter) | Through-Hole: 20:1 Blind Via: 1:1 |
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| Hole Edge to Hole Edge Distance | Same Net: ≥6 MIL Different Net: ≥10 MIL |
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| Average PTH Copper Thickness | 1oz: 18μm ≥2oz: 20μm | Production customized per customer selections upon order placement. |  |
| Hole Diameter Tolerance | PTH: ±3 MIL (0.075mm) NPTH: ±2 MIL (0.05mm) Press-Fit Hole: ±2 MIL (0.05mm) |
Standard press‑fit hole diameter:≤ 2.0 mm. For diameters ＞2.0 mm, standard hole‑size control is preferred. | |
| Hole Position Tolerance | Hole Center to Hole Center within Board: ±0.05MM Hole Center to Board Outline: ±0.1MM |
Limit: Hole‑to‑hole center distance (on board): ±0.03 mm | |
| For mechanical fixture holes, thermal pads or mounting pads. Plating‑related tolerances do not apply. | |||
| ①Plated slots: Guarantee reliable electroplating for connector / edge‑component cut‑outs. Well‑designed plated slots lower barrel‑cracking risk in reflow soldering. adopted for holes of 6.5 mm and above. ②Non‑plated slots: Used for isolation breakers & component clearance. |
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| Countersink Hole | Angle (A): Default 90°, tolerance ±10° | Countersink hole: Tapered hole for sinking screw heads below PCB surface to avoid thickness interference from protruding screw heads. |  |
| Diameter (B): 0.5-6.5mm, Through-Hole Diameter (C): ≥0.3mm | |||
| Depth (H): ≥0.1mm, Remaining Thickness ≥0.2mm | |||
| Copper Cutback Safety Distance (d): ≥ ±0.2mm [Requirement of 0.15mm needs review] | |||
| Step Hole | Hole Diameter (D): 0.5-1.8mm Hole Diameter (D) Tolerance: ±0.1mm (Limit: ±0.05mm) Depth Control (L) Tolerance: ±0.2mm (Limit: ±0.1mm) |
Step hole: Multi‑level hole structure created by stepped‑drilling during PCB manufacturing, critical for precision assembly, signal integrity and space optimization. |  |
| Back Drill | Through-Hole Diameter (D): 0.2-0.5mm (Resin filled after back drilling) | Back drill: Key process for multi‑layer PCBs to enhance signal integrity. Secondary drilling removes redundant copper stubs of through‑holes and reduces reflection, scattering and delay for high‑speed signals. |  |
| Back Drill Diameter (W): 0.2mm larger than through-hole drill | |||
| Back Drill Depth (L): Customer specifies target layer, depth tolerance ±0.1mm | |||
| Dielectric Thickness (T): ≥0.15mm (Distance from back drill bottom to nearest inner copper layer) | |||
| Safety Distance (S): ≥0.2mm (Distance from back drill hole edge to adjacent circuit pattern) | |||
| Back Drill Hole to Outer Layer Copper Distance (S2) ≥6 mil (Limit: ≥5 mil) | |||
| Castellated Holes | Diameter Range (∅): 0.4-6.35mm (Drilled); ≥6.4mm (Routed) | Castellated holes: Widely adopted for sub‑board assembly of wireless communication and high‑frequency RF modules. |  |
| Half-Hole Edge to Board Outline (L): ≥0.2mm | |||
| Half-Hole Edge to Half-Hole Edge (D): ≥0.5mm | |||
| Half-Hole Process Board Thickness: ≥0.6mm | |||
| Edge Plating | Minimum dimension for edge plating process: 10*10 mm | Edge plating means full copper plating followed by immersion gold on board sidewalls (HASL is not available for this process). |  |
| Minimum board thickness for edge plating process: ≥0.6 mm | |||
| For full side-wall edge plating: 3 mm wide copper-free break-away tabs are required (minimum 3 sets; 4 or more sets for larger size boards). | |||
| Blind Slot | ① Blind Slot Width (W): ≥1.0mm, Size tolerance ±0.13mm | Blind slot: Recessed pockets made by routing. Components or thermal copper blocks are embedded for heat dissipation post‑assembly. |  |
| ② Blind Slot Depth (D): ≥0.2mm, Depth tolerance ±0.15mm | |||
| ③ Blind Slot Annular Ring (A): ≥0.3mm (Refers to pad width for PTH blind slot) | |||
| ④ Safety Distance (S): ≥0.2mm (Distance from NPTH blind slot to adjacent circuit pattern) | |||
| ⑤ Blind Slot Remaining Thickness (R): ≥0.2mm (Distance from blind slot bottom to nearest inner copper layer / surface substrate) | |||
| ⑥ Supports board thickness (L) ≥0.8mm for 2-32 layer FR4/High-Frequency/High-Speed boards. |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Inner Layer Min. trace width and spacing | 1/3OZ: 2.7/2.7 MIL |  |
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| 1/2OZ: 3/3 MIL | |||
| 1OZ: regular 3.5/3.5 MIL limit 3/3 MIL | |||
| 2OZ: 5/5.5 MIL | |||
| 3OZ: 6/7.5 MIL | |||
| 4OZ: 7/11.5 MIL | |||
| 5OZ: 10/16 MIL | |||
| 6OZ: 14/20 MIL | Copper thickness ≥6 oz can be manufactured using a double-sided etching process. | ||
| Outer Layer Min. trace width and spacing | 1/3OZ: 3/3 MIL | ||
| 1/2OZ: 3/3 MIL | |||
| 1OZ: regular 4/4 MIL limit 3/3 MIL | |||
| 2OZ: regular6/8 MIL limit6/6.3 MIL | |||
| 3OZ: regular8/8 MIL limit 6/7.5 MIL | |||
| 4OZ: 10/12 MIL | |||
| 5OZ: 15/18 MIL | |||
| 6OZ: 18/20 MIL | Copper thickness ≥6 oz can be manufactured using a double-sided etching process. | ||
| Grid Width (W) and Spacing (L) | 1/2OZ, 1OZ: 8*8 MIL | Gaps within the same net that are smaller than the board's minimum trace width must be filled with copper pour. Trace stubs smaller than the minimum trace width should be removed to prevent film lifting. | %20and%20Spacing%20(L)-%E7%BD%91%E6%A0%BC%E5%AE%BD%E5%BA%A6%E5%92%8C%E9%97%B4%E8%B7%9D_%E4%B8%BB%E7%94%BB%E6%9D%BF%401x-compress.webp) |
| 2OZ: 10*10 MIL | |||
| 3OZ: 12*12 MIL | |||
| VIA to Trace (W) | 0.2mm | -%E5%AD%94%E9%97%B4%E8%B7%9D_%E4%B8%BB%E7%94%BB%E6%9D%BF%401x-compress.webp) |
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| PTH to Trace (H) | 0.3mm | ||
| NPTH to Trace (S) | 0.2mm | ||
| Pad to Trace (L) | 0.1mm | ||
| Different Net SMD Pad Clearance (E) | 0.15mm | ||
| Coil | 1oz Min. Trace Width/Space: 0.15/0.15mm | A special product that directly integrates coil or winding functions onto a printed circuit board (PCB). It is widely used in wireless charging, high‑frequency transformers, Radio‑Frequency Identification (RFID), various sensors and planar motors (e.g. camera OIS optical image stabilization) and other fields. |  |
| BGA Pad | ① BGA Pad Diameter (D) ≥0.25mm, Limit 0.2mm (price review needed) ② BGA Pad to Trace Clearance (W) ≥0.1mm ③ Via-in-Pad (VIP) with resin plugging + plating&capping is possible for through-holes (d) within BGA pad. |
BGA (Ball Grid Array): Widely used in CPU, GPU and high‑end communication chips, featuring high pin density, good electrical and thermal performance. |  |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Solder Mask Ink Thickness | On trace surface ≥10μm, at trace corner ≥8μm, on substrate: 20-40μm |
Ink thickness above copper surface ≤40μm. | |
| Solder Mask Dam | Green (W) ≥3 MIL; Matte Green, Blue (W) ≥4 MIL; Other colors (W) ≥5 MIL | On Immersion Tin substrate, min. dam (W) 4 MIL (Limit), optimal (W) 5 MIL; On Immersion Tin copper surface, min. dam (W) 6 MIL. |  |
| Text Width (formed on the substrate surface by removing the solder mask ink) |
HASL Board: On substrate ≥8 MIL; On copper≥12 MIL; ( with solder mask process only once ) On copper≥16 MIL, ≥20 MIL( with twice solder mask porcess ) |
Text spacing≥20μm. (formed on the substrate surface by removing the solder mask ink) |
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| Other Surface treatment: On substrate ≥8 MIL; On copper ≥10 MIL; (with solder mask process only once ) On copper ≥14 MIL, ≥18 MIL(with twice solder mask porcess) |
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| Plugged Via | ① Hole Diameter (D): 0.15-0.6mm (Only ensures no white light transmission, green light may transmit) ② Vias with tented pads on both sides can be plugged. ③ For double-sided boards with opening on one side and via diameter <0.4mm, only partial plugging possible (may transmit light). ④ If hole partially on opened pad, partial plugging (may transmit light), depends on specific design. |
Drill aluminum stencil matching PCB via locations via Laser drilling; press ink into vias with screen printer. |  |
| Resin Plug-hole | Plug Hole Diameter (D): 0.15-1.0mm | VIPPO process: Holes fully filled with special thermosetting epoxy via vacuum pressure potting; high‑temp cured, mechanically planarized, followed by surface copper plating. Used for HDI, BGA zones, 5G high‑speed boards and aerospace applications. |  |
| Board Thickness (L): 0.2-8.0mm | |||
| Processing Size: MAX: 660x800mm, MIN: 100x100mm |
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| Copper Paste Filled&Capped | Filled Hole Diameter (D): 0.25-0.5mm | Copper paste filled&capped: Vias filled with conductive copper paste (high‑purity copper powder + organic binder), cured then surface‑plated with copper. Offers outstanding thermal & electrical conductivity for high‑power modules, LED substrates, high‑current industrial boards and NEV motor modules. |  |
| Board Thickness (L): 0.2-8.0mm | |||
| Processing Size: MAX: 610x710mm, MIN: 250x250mm |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Legend Color | White/Black (Other colors contact customer service) |  |
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| Min. Line Width (L) | 6 mil (0.15mm) | ||
| Min. Text Height (H) | 40 mil (1.0mm) | ||
| Text Width to Height Ratio | 1:06 | ||
| Hollowed Text Width to Height Ratio | 1:06 | ||
| Pad to Legend Clearance | 6 mil (0.15mm) | ||
| QR Code (A) | 10x10mm, 8x8mm, 6x6mm |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Carbon Ink | Extension beyond covered conductor per side (L): ≥6 mil | Semi‑cured conductive ink: Main ingredients: graphite, carbon powder, resin, hardener. Screen‑printed on target PCB areas; baked & cured to form carbon film for conductive contacts. |  |
| Carbon Ink to Carbon Ink Spacing (H) ≥16 mil | |||
| Carbon Ink to adjacent exposed conductor spacing (W) ≥10 mil | |||
| Peelable Blue Mask | Extension beyond covered conductor per side ≥6 mil | One‑component blue viscous insulating ink: Screen‑printed on PCB surface, baked for protection; fully peelable by hand with zero residue after downstream processes. | |
| Blue Mask to adjacent exposed conductor spacing ≥16 mil |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| Routing Profiling | ① Trace and pad to board edge distance (S) at routing area: ≥0.2 mm | For precision routing, the single‑piece PCB dimension shall be ≥ 50 × 50 mm. Precision routing requires 3 positioning holes in different orientations with diameter ≥ 1.5 mm. Please select precision routing at order placement if needed. If the design does not support precision routing, standard routing will be applied by default. |  |
| ② Trace and pad to routing slot distance (A): ≥0.2 mm | |||
| ③ Routing outline tolerance: ±0.2 mm (standard routing), ±0.1 mm (precision routing) | |||
| Minimum routing‑slot width (H) for Aluminum/Copper core PCB: 1.6 mm | |||
| Internal Slot Size (PTH) | Routed Slot (H): ≥0.8mm (Standard), Slot Tolerance: ±0.1mm (Routed) ≥0.6mm (Limit), higher cost, price review needed. |
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| V-CUT | ① Trace/Pad distance to board edge at V-cut location ≥0.4mm | ||
| ② V-cut outline tolerance: ±0.4mm (for board thickness ≥0.6mm) | |||
| ③ Default uses zero-clearance panelization (For panels needing V-cut on only two sides, the other two sides can use 1.6mm or 2mm spacing for routing separation). | |||
| ④ Min. panel size for V-cut: 70mm. Max. panel size: 1000x1500mm. | |||
| ⑤ Distance between adjacent V-cut lines: 3mm (Limit 2mm). | |||
| ⑥ Default standard angles: 25°/30°. Other angles require note. | |||
| ⑦ Board thickness: 0.4-3.0mm, Remaining thickness accuracy: ±0.1mm. | |||
| Breakaway Tab Panelization | ① Non-tab area: Trace/Pad distance to board edge (S) ≥0.2mm |  |
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| ② Non-tab area routing tolerance: ±0.2mm (Standard), ±0.1mm (Precision) | |||
| ③ Panel Spacing (L): Default uses 1.6mm or 2mm. | |||
| ④Edge Rail Width (W): ≥3mm (Our SMT requires 5mm width, Fiducial (M) 1mm, Tooling Hole (P) 2mm, Fiducial center to board edge (A) 3.85mm) | |||
| ⑤ Tab area will have mouse-bite appearance after depanelization. | |||
| Gold Finger Beveling | ① Bevel Angle (A): 15°-45°, typically 30° | Bevel on gold‑finger tip: Specific‑angle bevel facilitates smooth PCB insertion into female socket; avoids scratching socket metal springs and plating peeling during mating cycles. |  |
| ② Bevel Angle Tolerance: ±5° | |||
| ③ Board Thickness for Beveling (L): 0.8-2.4mm | |||
| ④ Bevel Remaining Thickness & Tolerance: ±0.15mm | |||
| ⑤ Beveling Dimensions: Min. 50x80mm, Max. 500x200mm |
| Item Content | Advanced | Description | Pattems |
|---|---|---|---|
| HASL (Lead/Lead-Free) | Standard Tin Thickness (D): 1-40μm | Min. Pad Diameter for HASL with Lead: 0.25mm Min. Pad Diameter for HASL Lead-Free: 0.28mm |
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| Board Thickness (L): 0.3-5.4mm | |||
| Processing Size: Max. 1300x400mm (Single-sided), 650x560mm (Double-sided/Multilayer), Min.: 50x50mm | |||
| OSP | Organic Film Thickness: 0.20-0.60μm |  |
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| Board Thickness: 0.4-5.0mm | |||
| Processing Size: Min. 80x80mm | |||
| ENIG | Standard Thickness: Nickel 120~300μ" (adjustable per request), Gold 1~5μ" |  |
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| Board Thickness: 0.2mm-4.5mm | |||
| Processing Size: Min. 100x100mm (Prototype 50x50mm); Max. 600x1200mm | |||
| Immersion Tin | Standard Tin Thickness: 1.0-1.3μm |  |
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| Board Thickness: 0.3-4.0mm | |||
| Processing Size: Min. 100x150mm (100x100mm), Max. short side <610mm | |||
| Immersion Silver | Standard Silver Thickness: 0.15-0.40μm |  |
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| Board Thickness: 0.4mm-4.0mm | |||
| Processing Size: Min. 100x100mm (Long side ≥100mm, Short side ≥60mm), Max. short side <610mm | |||
| ENEPIG | Standard Thickness: Nickel 120~300μ" (adjustable), Palladium 1~2μ" (Max 20μ"), Gold 1~5μ" |  |
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| Board Thickness: 0.3mm-4.0mm | |||
| Processing Size: Min. 200x200mm; Max. 600x900mm | |||
| Gold Plating | Standard Thickness: Nickel 80-300μ", Gold 1-80μ" |  |
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| Board Thickness: 0.6mm-4.0mm | |||
| Processing Size: 600x600mm (One side can exceed 600mm), Min. 200x100mm |
