Soldering Aluminum PCBs: A Comprehensive Guide for Robust Connections
Discover practical techniques for soldering aluminum PCBs, including optimal temperatures, solder paste selection, and methods for both reflow and hand soldering.
PCB Types
How to Design an Effective 16-Layer PCB Stackup for High-Performance Electronics
Explore key principles for a 16-layer PCB stackup, including optimal layer arrangement, signal integrity, and power distribution, to create robust boards for complex applications.
What You Need to Know About Copper Weight in PCB Design
Optimize PCB designs by understanding copper weight. This guide explains its impact on current capacity, thermal performance, and IPC standards for trace thickness.
Designing with Four-Layer PCBs: A Comprehensive Guide
Explore the essentials of 4-layer PCB design, including stackup choices, routing strategies, and manufacturing best practices for optimal signal integrity and performance.
IPC Standards for PCB Copper Weight: Ensuring Quality and Reliability
Understand IPC copper weight requirements for PCBs. This guide details IPC-2221B and IPC-6012E standards for trace thickness, hole plating, and reliability in PCB manufacturing.
Multi-Layer PCB Stackup: Optimizing for Signal Integrity and Power Distribution
Optimize multi-layer PCB designs with proven stackup strategies. This guide details 4-16 layer configurations, power distribution, impedance control, and EMC for signal integrity.
Multi-Layer PCBs: A Beginner's Guide to Design and Fabrication
Learn multi-layer PCB design basics for beginners. This guide covers 4-layer and 6-layer stack-ups, routing rules, and fabrication tips to create reliable, cost-effective PCBs.
Testing and Inspection Methods for Multi-Layer PCBs: Guaranteeing Performance
Ensure multi-layer PCB quality with advanced testing. This guide details AOI, X-ray, electrical, and microsection inspection methods for complex PCB designs.
Designing a 6-Layer PCB for EMI/EMC Compliance: A Comprehensive Guide
Optimize 6-layer PCB designs for EMC compliance. This guide details stack-up, grounding, shielding, and filtering techniques for engineers to pass EMI/EMC testing.
Routing Challenges and Solutions on 4-Layer PCBs
Address 4-layer PCB routing challenges with proven strategies. This guide covers signal integrity, power distribution, and BGA fanout for effective multilayer PCB design.
Minimizing Warpage in Multilayer PCB Manufacturing: Causes and Cures
Optimize multilayer PCB manufacturing by preventing warpage. This guide details causes, material selection, process controls, and stress relief techniques for complex boards.
Material Matters: Selecting the Best Laminates for High-Frequency Multilayer PCBs
Optimize high-frequency PCB performance with advanced low-loss laminates. This guide compares electrical, thermal, and mechanical properties for designs exceeding 20 GHz.
