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4 Layer Flexible PCB Production Record #FPC-20250917-0076

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 30 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 138.2 x 75 mm Copper Weight 1/2OZ
Thickness 0.23 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Sep 10 21:46
Files Ready
Sep 10 21:46
Engineering Review Completed
Sep 10 23:46
Payment down
Sep 10 23:46
Production Started
Sep 10 23:49
Production Completed
Sep 16 13:48
Progress: 0/6
Engineering Review time: 3
Production time: 5.5d

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
DHL
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Sep 17 14:28

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer flexible PCB measured 138.2 × 75 mm with a finished thickness of 0.23 mm and used rolled copper at ½ oz weight. Produced as single boards for a quantity of 30 pieces, the design featured tight 3/3 mil line/space geometry, 0.2 mm minimum holes, yellow coverlay, white silkscreen, and ENIG surface finish. A PI stiffener was applied, bringing the combined FPC + PI thickness to 0.31 mm.

 

DFM coordination confirmed the stackup tolerances of ±0.05 mm for both the flex core and the stiffened region. Silkscreen frames overlapping pads were removed to avoid interference with soldering. Gold finger areas were extended by 0.1 mm so the coverlay could fully secure the edges and reduce the risk of finger peeling during handling and assembly. These adjustments preserved the mechanical integrity of the thin flexible construction.

 

The revised coverlay registration and finger extension were implemented prior to production. Consistent ENIG plating and precise thickness control across the 4-layer flex structure were achieved, ensuring reliable flexibility and interconnection. The order was completed with full dimensional and electrical verification, delivering boards that met the specified thin-flex and stiffener requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-042 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail

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