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4 Layer Flexible PCB Production Record #FPC-20251101-0068

Start Flexible PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 10 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 112.5 x 42.5 mm Copper Weight 1OZ
Thickness 0.35 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener FR4 Stiffener

Manufacturing Timeline

Order Created
Oct 11 13:17
Files Ready
Oct 11 13:17
Engineering Review Completed
Oct 11 13:38
Payment down
Oct 11 13:38
Production Started
Oct 11 13:39
Production Completed
Oct 31 13:55
Progress: 0/6
Engineering Review time: 21 min
Production time: 20.1d

Logistics Information

Production Completed→Shipping : 1.2d
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Nov 01 17:55

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Polyimide Material Handling
06
Inner Layer Imaging
07
Circuit Imaging & Etching
08
Layer Stack Alignment
09
High Pressure Lamination
10
Coverlay Lamination
11
Solder Mask Application
12
Electroless Nickel Deposition
13
Immersion Gold Deposition
14
TDR Impedance Testing
15
Dynamic Flex Testing
16
Electrical Testing

Manufacturing Summary

This order required manufacturing ten units of a 4-layer FPC using rolled copper and polyimide material. With dimensions of 112.5 x 42.5 mm and a total thickness of only 0.35 mm, the design incorporated FR4 stiffeners for added rigidity in specific zones. Due to the tighter 4/4 mil minimum track and spacing, the fabrication process included precise circuit imaging, etching, and trace width compensation.

 

Engineering review and stackup impedance engineering ensured proper layer configuration before high pressure lamination and layer stack alignment. Following coverlay lamination, solder mask application, and electroless nickel with immersion gold deposition, the boards received TDR impedance testing together with dynamic flex testing. This verified both the electrical parameters and the circuit's resilience to bending. White silkscreen printing provided clear identification on the yellow soldermask background. Every board passed strict electrical testing.

 

Production for this impedance controlled flexible PCB was completed in 20.1 days, yielding a reliable product set that aligns with the customer's technical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

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