1 Layer FR4 PCB Production Record #FR4-20251209-014

This production record covers a batch of standard 4-layer FR4 PCBs featuring 1.6 mm overall thickness and 1 oz copper weight. With minimum track and spacing set at 6 mil, the geometry followed standard industry tolerances that support reliable etching outcomes without requiring advanced process adjustments. We performed the engineering review and material preparation before moving into circuit imaging to accurately transfer the pattern onto the cores and prepregs.

Subsequent solder mask application achieved good coverage and alignment across the panels. The boards then received molten solder coating and hot air leveling, delivering a uniform HASL Lead Free surface that ensures long shelf life and straightforward assembly. Final electrical testing verified complete functionality on all units produced.

The entire order moved through the facility in 2.5 days, yielding consistent results in terms of copper uniformity, solder mask adhesion, and post-leveling surface quality. This execution reflects the dependable processes applied to conventional multilayer boards, providing the customer with PCBs ready for immediate use in their electronic systems.