1 Layer FR4 PCB Production Record #FR4-20251215-006

We produced five single-layer FR4 panel PCBs to the specified parameters, with each panel measuring 150 × 115 mm and built at a standard 1.6 mm thickness using 1 oz copper. The design followed conventional 6/6 mil trace and spacing geometry together with 0.3 mm minimum holes, green solder mask, white silkscreen, and HASL Lead Free finish. No impedance control was required, allowing the job to proceed on standard FR4 material and default stackup without additional controls.

After engineering review and material preparation, we executed circuit imaging and etching to define the single-sided copper pattern. Solder mask was applied and cured before molten solder coating and hot air leveling created a uniform, oxidation-resistant HASL Lead Free surface. These process steps were sequenced to match the modest five-panel quantity while preserving edge quality and plating consistency on the 0.3 mm holes.

Final electrical testing confirmed isolation and continuity across all panels. The complete order moved from raw material to tested product in 1.6 days, delivering boards that met every dimensional and functional requirement for straightforward customer assembly.