High Layer Count FR4 PCB Production Record #FR4-20260709-064

For this order we produced 1500 units of 12-layer FR4 boards with a finished thickness of 3.0 mm and a custom stackup. The compact 58 × 24.9 mm boards used 1 oz copper and standard 6/6 mil geometry, with all holes at or above 0.3 mm. During inner layer imaging, circuit etching, and high-pressure lamination we maintained tight registration to accommodate the increased layer count and board thickness, ensuring flatness and interlayer alignment without blind vias or impedance requirements.

Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, delivering a uniform ENIG surface finish suited to the design. Each production panel received AOI after solder mask and full electrical testing at completion, verifying continuity across the 12 layers. The absence of advanced features allowed the process to focus on plating consistency and dimensional stability for the thicker multilayer construction.

Completed over 17.2 days, the run yielded boards that met every specified parameter. Material preparation through final inspection supported repeatable quality, confirming reliable via formation and layer bonding for this specific 12-layer configuration.