High Layer Count FR4 PCB Production Record #FR4-20260720-046

This 10-layer FR-4 PCB measured 324.8 × 76.8 mm with 1.6 mm thickness, TG170 material, and asymmetric copper of 0.5 oz inner / 1 oz outer. Produced as 30 pieces in 1×2 panels for 15 sets, the order used ENIG surface finish (1 µin gold), green solder mask, and white silkscreen. The design included controlled impedance, resin-plugged vias, gold fingers with bevel, and 0.3 mm minimum holes at standard 6 mil line/space. Process edges of 4 mm on the left and right sides supported V-cut separation. The 20-day schedule included 100% flying probe testing.

DFM review focused on stackup, impedance, and production-file alignment. The supplied production draft was confirmed as the manufacturing reference. Customer stackup and impedance requirements were adjusted slightly to match available materials while preserving overall targets. Differential impedance line spacing in the notes did not match the actual Gerber data, and several impedance lines referenced layers that did not exist in the stackup; control was limited to the traces that could be clearly identified and compensated.

Confirmed stackup revision, impedance scope, and file alignment were implemented prior to production. The long multilayer boards achieved consistent ENIG plating, reliable resin filling, and controlled impedance performance within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.