High Layer Count FR4 PCB Production Record #FR4-20260715-043

We manufactured 100 pieces of these compact 10-layer FR4 circuit boards in single-board format, each measuring 37.15 × 31.3 mm and finished to 1.0 mm thickness. The custom stackup employed 1 oz copper on all layers with 10/10 mil minimum track and spacing. Green soldermask, white silkscreen, and immersion gold ENIG surface finish were applied according to specification. The absence of blind vias and impedance control allowed standard multilayer processing while directing attention to registration accuracy within the constrained board thickness.

Engineering review confirmed the stackup details prior to PCB material preparation and inner layer imaging. Precise layer stack alignment preceded high pressure lamination, ensuring reliable interlayer connections across all ten layers. Solder mask application was followed by electroless nickel deposition and immersion gold deposition to produce a flat, corrosion-resistant surface. Final electrical testing verified net continuity and isolation on every board produced.

Production was completed in 14.1 days with stable parameters maintained throughout the run. The batch exhibited consistent quality, delivering multilayer boards that fully conformed to the specified dimensions, copper weights, and ENIG finish requirements.