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4 Layer Flexible PCB Production Record #FPC-20251125-0073

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 150 x 15.1 mm Copper Weight 1/2OZ
Thickness 0.23 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener pi,fr4

Manufacturing Timeline

Order Created
Oct 17 09:26
Files Ready
Oct 17 09:26
Engineering Review Completed
Oct 17 15:23
Payment down
Oct 17 15:23
Production Started
Oct 17 15:23
Production Completed
Nov 05 17:09
Progress: 0/6
Engineering Review time: 4 h
Production time: 19.1d

Logistics Information

Production Completed→Shipping : 1.2d
Carrier
DHL
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Nov 06 19:47

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This production record details a 4-layer flexible printed circuit manufactured in panel format with rolled copper and a finished thickness of 0.23 mm. Measuring 150 by 15.1 mm, these boards featured a challenging 3/3 mil minimum track and spacing alongside 0.15 mm holes. The yellow soldermask paired with white silkscreen created a distinctive appearance, while PI and FR4 stiffeners were added to selective areas for component support.

 

During manufacturing, polyimide material handling received special attention to preserve the integrity of the thin laminate. Inner layer imaging gave way to precise circuit etching, high-pressure lamination, and FPC coverlay application. Immersion gold ENIG provided excellent solderability and corrosion resistance on the half-ounce copper.

 

Following solder mask application and surface finishing, we conducted dynamic flex testing to validate performance under repeated bending. Electrical testing on all 20 panels confirmed full functionality. The entire process extended over 19.1 days, allowing for thorough quality checks at each critical stage and delivering reliable flexible circuits tailored to the specified parameters.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

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