2 Layer Flexible PCB Production Record #FPC-20260305-093

Production of these 2500 flex PCBs centered on the challenging 318.2 × 8.5 mm panel format at 0.2 mm thickness using rolled copper on polyimide. Material preparation and handling focused on controlling shrinkage and maintaining flatness across the narrow, elongated panels while preserving the inherent bend characteristics of the 2-layer construction. With 6/6 mil geometry and 0.3 mm minimum holes, the design stayed within conventional tolerances yet demanded exact registration during coverlay alignment.

Circuit imaging and etching were followed by coverlay lamination and white solder mask application before electroless nickel and immersion gold deposition created the ENIG finish. Dynamic flex testing validated endurance across multiple bend cycles on sample panels drawn from each batch. The absence of stiffeners placed additional importance on consistent material properties to prevent wrinkling or distortion after processing.

Batch AOI inspection and full electrical testing confirmed uniformity across all delivered panels during the 31-day run. Resulting circuits showed stable mechanical and electrical performance suited to compact assemblies where long, slim flexible interconnects are required.