Single Layer Flexible PCB Production Record #FPC-20260306-091

This production record covers 50 units of single-layer flex circuit boards, each measuring 28.5 mm × 800 mm with an overall thickness of 0.1 mm. Fabricated on rolled copper at 1/3 oz, the circuits used 6/6 mil trace and spacing, yellow soldermask, white silkscreen, PI stiffeners in select areas, and immersion gold ENIG finish. The long, narrow format and thin cross-section required careful material selection to balance flexibility with dimensional stability during PCB assembly.

Polyimide material handling, circuit imaging, etching, and coverlay lamination were performed first, followed by solder mask application. Electroless nickel deposition and immersion gold deposition were calibrated for the extended trace lengths to maintain uniform thickness and adhesion. We monitored each panel throughout these steps to preserve the substrate’s natural bend characteristics.

Dynamic flex testing and full electrical testing verified mechanical endurance and circuit integrity across the entire batch. Completed in 10 days, the run produced consistent flexible PCBs suited for applications needing reliable performance in compact, moving assemblies.