PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 10 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 39.25 x 69.25 mm | Copper Weight | 1/2OZ |
| Thickness | 0.23 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Black | Silkscreen | White |
| Material | Rolled Copper | Stiffener | FR4 Stiffener |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This 4-layer FPC run involved a quantity of 10 boards with compact dimensions of 39.25 x 69.25 mm and an ultra-thin 0.23 mm thickness. Built with rolled copper at 1/2 oz on polyimide material, the design specified 6/6 mil traces, 0.3 mm holes, FR4 stiffeners, black soldermask, white silkscreen, and immersion gold ENIG finish.
We executed the manufacturing with focused polyimide material handling, accurate inner layer imaging and etching, followed by layer stack alignment and high pressure lamination. Coverlay lamination protected the flexible areas while solder mask was applied to stiffened sections. Dynamic flex testing validated mechanical reliability prior to electrical testing.
Completed in 24 days, the process yielded consistent boards that performed reliably in both flex endurance and electrical parameters, meeting all requirements for this multilayer flex application.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260821-065 | Flexible PCB | 4 | 111.25 x 16.75 | Yellow | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260819-026 | Flexible PCB | 4 | 59.8 x 65.5 | Yellow | ENIG (Immersion Gold) | 25 | View detail |
| FPC-20260810-032 | Flexible PCB | 4 | 357 x 45.8 | Black | ENIG (Immersion Gold) | 1000 | View detail |
