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4 Layer Flexible PCB Production Record #FPC-20260321-0036

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 15 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 38.8 x 128.4 mm Copper Weight 1OZ
Thickness 0.23 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White
Material Rolled Copper Stiffener FR4 Stiffener

Manufacturing Timeline

Order Created
Feb 24 00:00
Files Ready
Feb 24 00:19
Engineering Review Completed
Feb 24 16:34
Payment down
Feb 24 16:34
Production Started
Feb 24 16:34
Production Completed
Mar 18 18:44
Progress: 0/6
Engineering Review time: 0.7d
Production time: 22.1d

Logistics Information

Production Completed→Shipping : 3.0d
Carrier
FedEx IP
Destination
INDIA
Shipping Method
Express Air
Shipping Time
Mar 21 17:57

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Polyimide Material Handling
06
Inner Layer Imaging
07
Circuit Imaging & Etching
08
Layer Stack Alignment
09
High Pressure Lamination
10
Coverlay Lamination
11
Solder Mask Application
12
Electroless Nickel Deposition
13
Immersion Gold Deposition
14
TDR Impedance Testing
15
Dynamic Flex Testing
16
Electrical Testing

Manufacturing Summary

For this order of 15 four-layer flex PCBs, production used 0.23 mm thick rolled copper on polyimide, with board dimensions of 38.8 × 128.4 mm. The design incorporated tight 3/3 mil trace spacing, black soldermask, white silkscreen, and selective FR4 stiffeners. These elements required precise FPC material preparation and polyimide handling to preserve flexibility while meeting the fine geometry and multilayer registration demands.

Stackup impedance engineering guided the inner layer imaging, circuit etching, and high-pressure lamination steps. Coverlay lamination was followed by electroless nickel and immersion gold deposition to produce a uniform ENIG finish. We validated the impedance controlled PCB through TDR testing, dynamic flex testing, and 100% electrical testing, confirming all boards met both electrical and mechanical criteria.

Over the 22-day schedule the lot maintained consistent trace profiles, hole quality above 0.3 mm, and layer alignment, delivering reliable flexible circuits suited to applications requiring controlled impedance and repeated bending.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

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