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4 Layer Flexible PCB Production Record #FPC-20260416-083

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 1000 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 357 x 45.8 mm Copper Weight 1/3OZ
Thickness 0.23 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White
Material Rolled Copper Stiffener Steel Sheet Stiffener

Manufacturing Timeline

Order Created
Mar 25 09:28
Files Ready
Mar 25 09:28
Engineering Review Completed
Mar 25 11:28
Payment down
Mar 25 09:30
Production Started
Mar 25 11:28
Production Completed
Apr 16 15:24
Progress: 0/6
Engineering Review time: 2h
Production time: 22.2d

Logistics Information

Production Completed→Shipping : 4.9 h
Carrier
FedEx IP
Destination
SERBIA, REPUBLIC OF
Shipping Method
Express Air
Shipping Time
Apr 16 20:14

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

This production record covers 1000 units of 4-layer flexible PCBs built on polyimide with 1/3 oz rolled copper. Measuring 357 × 45.8 mm and only 0.23 mm thick, the boards required careful material handling to preserve flexibility while achieving reliable multilayer registration. Specifications included 6/6 mil trace spacing, 0.3 mm minimum holes, black soldermask, white silkscreen, immersion gold ENIG finish, and steel sheet stiffeners selectively applied for component support.

 

Manufacturing followed a sequence of polyimide preparation, inner layer imaging, precise layer stack alignment, and high-pressure lamination. Coverlay lamination preceded solder mask application and the electroless nickel and immersion gold deposition steps. These processes were tuned to maintain dimensional stability across the long, narrow panels without inducing stress in the thin construction.

 

Dynamic flex testing, batch AOI inspection, and full electrical testing confirmed consistent performance throughout the run. All boards met the specified electrical and mechanical requirements, completing the order in 22.2 days with stable yield and repeatable quality for this multilayer flex configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-042 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail

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