PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 15 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 61.48 x 40.77 mm | Copper Weight | 1/2OZ |
| Thickness | 0.23 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | FR4 Stiffener |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order involved 15 pieces of a 4-layer impedance-controlled FPC on polyimide with rolled copper. Measuring 61.48 × 40.77 mm and only 0.23 mm thick, it used 1/2 oz copper layers with 4/4 mil minimum trace and spacing. FR4 stiffeners provided localized rigidity, complemented by yellow soldermask, white silkscreen, and immersion gold ENIG finish.
Engineering review and stackup impedance engineering addressed the tight tolerances of this thin multilayer flex design. We exercised care in polyimide material handling, inner layer imaging, and high-pressure lamination to achieve accurate alignment. After coverlay application, solder mask processing, and ENIG plating, TDR testing verified impedance while dynamic flex testing confirmed performance.
The full batch passed electrical testing with consistent outcomes, supporting reliable deployment in the intended flexible circuit application.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260821-065 | Flexible PCB | 4 | 111.25 x 16.75 | Yellow | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260819-026 | Flexible PCB | 4 | 59.8 x 65.5 | Yellow | ENIG (Immersion Gold) | 25 | View detail |
| FPC-20260810-032 | Flexible PCB | 4 | 357 x 45.8 | Black | ENIG (Immersion Gold) | 1000 | View detail |
