PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 130 x 118 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | HASL Lead Free | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order involved production of standard 4-layer FR4 PCBs with a finished thickness of 1.6mm and 1oz copper weight across all layers. Given the 6/6 mil track to spacing ratio, we utilized conventional exposure and etching parameters during the inner layer imaging and circuit imaging stages. Material preparation included selecting compatible FR4 cores and prepregs, while layer stack alignment prior to high pressure lamination ensured tight registration tolerances were met for the multilayer stackup.
Solder mask application preceded the molten solder coating and hot air leveling processes, which delivered a durable HASL Lead Free finish known for its excellent solder wettability. We then performed electrical testing to confirm netlist accuracy and insulation resistance on the completed boards. The entire manufacturing cycle progressed smoothly over a period of 3.3 days.
The execution of these process steps resulted in PCBs that offer consistent performance and structural integrity, meeting the requirements for reliable operation in the customer's end products.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260430-043 | FR4 PCB | 6 | 171.2 x 305 | Green | HASL Lead Free | 5 | View detail |
| FR4-20260418-085 | FR4 PCB | 6 | 32 x 46 | Green | ENIG (Immersion Gold) | 15 | View detail |
| FR4-20260418-083 | FR4 PCB | 6 | 25 x 50 | Green | ENIG (Immersion Gold) | 15 | View detail |
