1 Layer FR4 PCB Production Record #FR4-20260102-005

We produced 160 single-layer FR4 Panel PCBs with dimensions of 90.25 x 56 mm, 1.6 mm thickness, and 1 oz copper weight. The design called for standard 6/6 mil track and spacing along with 0.3 mm minimum holes, following the customer’s custom stackup. These parameters were processed using conventional fabrication methods while the panel format allowed efficient handling of the full order quantity.

Manufacturing followed a sequenced flow of engineering review, material preparation, circuit imaging and etching, then green solder mask application with white silkscreen. Immersion gold ENIG surface finish was formed through electroless nickel deposition and immersion gold deposition to produce uniform pad coverage on the single-layer boards. This finish choice provided flat, oxidation-resistant surfaces suited to the board’s end-use requirements.

Full electrical testing verified continuity and isolation across all 160 panels. The complete production run was completed in 3.5 days with stable registration and plating consistency maintained from first to last panel.