6 Layer FR4 PCB Production Record #FR4-20260918-033

For this order of 6-layer impedance controlled FR4 PCBs, production involved five small panels measuring 55 by 41.7 mm with 1.6 mm thickness and 1 oz copper. The specifications called for a standard 6/6 mil trace and spacing geometry, 0.3 mm minimum hole size, green solder mask, and white silkscreen. ENIG immersion gold surface finish was selected to provide superior oxidation resistance and contact reliability.

Stackup impedance engineering guided the material preparation and lamination sequence to achieve the required electrical characteristics. Inner layer imaging, circuit etching with trace width compensation, and high pressure lamination ensured precise registration across the multilayer stack. Solder mask application preceded the electroless nickel and immersion gold deposition steps.

TDR impedance testing and full electrical testing validated each panel before shipment. The entire manufacturing sequence was completed over 13 days, resulting in consistent board quality that met all impedance and dimensional tolerances for this panelized FR4 build.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→