2 Layer FR4 PCB Production Record #FR4-20260912-059

This production record covers a batch of 100 panels of 2-layer FR4 PCBs featuring 2oz copper on a 2.4 mm thick core. With overall panel dimensions reaching 275 x 193.7 mm, the job stood out for its substantial size and heavier copper weight, which influenced material selection and process parameters from the start. Engineering review focused on optimizing the custom stackup to ensure mechanical stability throughout fabrication.

We incorporated thick copper electroplating and controlled copper etching during the circuit imaging stage to maintain the integrity of the 6/6 mil traces and spaces. After solder mask application in green and white silkscreen printing, the panels received an immersion gold ENIG finish via electroless nickel deposition and immersion gold deposition. These steps delivered uniform plating thickness and excellent surface quality across the large panels.

Comprehensive electrical testing verified the functionality of all circuits before the order was completed in 4.5 days. The executed processes resulted in consistent panel quality, providing the customer with dependable boards that align with their specified requirements for thickness, copper weight, and surface treatment.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→