6 Layer FR4 PCB Production Record #FR4-20260204-068

This production record details a standard 4-layer FR4 PCB run using 1.6 mm finished thickness and 1 oz copper weight across all layers. The design called for 0.3 mm minimum hole size together with 6 mil trace width and spacing, placing the geometry in conventional territory that our etching and drilling parameters handle routinely. Material preparation fed directly into inner layer imaging, circuit imaging and etching, followed by careful layer stack alignment and high pressure lamination to secure registration across the stackup.

Solder mask application preceded molten solder coating and hot air leveling, producing a consistent HASL Lead Free surface finish suited to both through-hole and surface-mount assembly. Electrical testing at completion verified continuity and isolation on every net, confirming the boards met all specified requirements without rework. The absence of impedance control or finer geometries allowed the line to maintain standard process speeds while still delivering uniform copper distribution and laminate integrity.

Completed in 2.5 days from initial engineering review to final packed panels, the order left the floor with stable thickness tolerance and clean edge definition. These execution details provide customers with multilayer PCBs that perform reliably in standard operating environments.