6 Layer FR4 PCB Production Record #FR4-20260407-027

This 6-layer board measured 142.4 × 219.6 mm with 1.6 mm thickness, TG170 material, and heavy 3 oz copper on both sides. Produced as 300 pieces in 1×4 panels for 75 sets, the order used ENIG surface finish (1 µin gold, approximately 47 % coverage), green solder mask, and no silkscreen. Minimum holes were 0.3 mm with standard 10 mil line/space and high hole density. Resin plugged vias were specified, and the 13-day schedule included 100% flying probe testing together with mechanical routing.

DFM review resolved marking, thickness, and material constraints. Production numbering was required, yet no silkscreen layer existed; the mark was therefore proposed on the solder-mask surface. Panel connection tabs measured only 0.8 mm, raising the question of whether the customer would perform self-depanelization with a machine. The stackup constructed from the supplied drawing produced a finished PCB thickness of 1.5 mm rather than the nominal 1.6 mm. Notes referenced a paste layer and stencil return, but no paste data was present. Because Shengyi TG170 core was unavailable, NP-175FTL was substituted and the stackup was re-adjusted accordingly.

Confirmed marking placement, thickness acceptance, material substitution, and stackup revision were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and reliable resin filling across the 6-layer construction. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.