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4 Layer FR4 PCB Production Record #FR4-20260420-106

FR4 PCB 4 Layers HASL Lead Free Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 720.09 x 55.68 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Mar 27 15:06
Files Ready
Mar 27 15:06
Engineering Review Completed
Mar 27 15:28
Payment down
Mar 30 16:29
Production Started
Mar 30 16:32
Production Completed
Apr 14 17:43
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 15.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 6.2d
Carrier
FedEx IP
Destination
AUSTRIA
Shipping Method
Express Air
Shipping Time
Apr 20 20:58

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 720.09 × 55.68 mm at 1.6 mm thickness with 1 oz copper on all layers. The 10-piece order used lead-free HASL surface finish, green solder mask, and 6 mil minimum trace/space — standard geometry for this configuration. Production employed single-board format with mechanical forming and via tenting, completed within the 15-day schedule after full DFM review.

 

Several file discrepancies required clarification. A small gap between trace and pad was noted as intentional open design rather than defect. Via treatment showed mismatch between order requirement for cover oil and actual gerber double-sided openings, resolved by confirming process capability to minimize ink intrusion risks. Silkscreen dots at only 1 mil were flagged as unmanufacturable due to resolution limits and adjusted. Pads without openings faced potential ink coverage; these were verified against customer intent. Characters overlapping pads were reviewed for selective removal or relocation where space allowed, while factory serial number was added to the top layer. Irrelevant layers in the data were confirmed for omission.

 

All adjustments were implemented and re-confirmed before lamination and etching. Electrical testing verified continuity and quality on delivery. For details on the via mask window resolution and related silkscreen handling, refer to the engineering case study.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail
FR4-20260618-018 FR4 PCB 2 54.74 x 106.93 Green HASL Lead Free 5 View detail

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