High Layer Count FR4 PCB Production Record #FR4-20260427-035

This 14-layer FR-4 board measured 278.7 × 215.82 mm with 2.4 mm thickness, TG170 material, and heavy 2 oz copper on both sides. Produced as 5 single pieces, the order used ENIG surface finish (1 µin gold), red solder mask, and white silkscreen. Minimum holes were 0.2 mm with a tight 4 mil line/space geometry. Resin-plugged vias were specified, and the customer self-panel format relied on mechanical routing. The 15-day schedule included 100% flying probe testing.

DFM review resolved process-edge, via, and documentation details. The auxiliary border lacked copper pour; copper was added to the process edge to improve balance with the actual stackup. Resin plugging combined with tenting was required, yet bottom-side holes carried openings in the source data and needed clarification. Factory code, year-week cycle mark, and sequential serial numbers (01–05) were added as proposed. Certain guard holes highlighted in the data required confirmation of whether resin fill applied. Layer names and sequence positions showed inconsistencies, with some layers absent from the listed order, requiring explicit alignment before release.

Confirmed edge copper addition, via treatment, marking content, and layer-sequence alignment were implemented prior to production. The high-layer heavy-copper boards achieved consistent ENIG plating and reliable resin filling within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.