High Layer Count FR4 PCB Production Record #FR4-20260522-050

This order comprised ten 323.6 × 323.6 mm 10-layer FR4 panels built on a custom stackup with 2 oz copper weight and 1.6 mm finished thickness. Material preparation and high-pressure lamination received close attention to maintain layer registration across the large panel format, while thick copper electroplating and controlled etching preserved the standard 6/6 mil trace and spacing without undercutting or bridging. The absence of blind vias and impedance control allowed conventional drilling of 0.3 mm minimum holes and straightforward via filling prior to outer-layer processing.

Green solder mask and white silkscreen were applied before electroless nickel deposition and immersion gold plating, producing a flat ENIG surface finish that supports consistent solder joint formation. Every panel completed full electrical testing to confirm net continuity and isolation. The 24.5-day production window accommodated the sequential processes from engineering review through final inspection, delivering uniform boards that met all dimensional and plating requirements.