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2 Layer FR4 PCB Production Record #FR4-20260611-021

FR4 PCB 2 Layers HASL Lead Free Heavy Copper Mass Production
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 1400 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 245.59 x 304.79 mm Copper Weight 3oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask White Silkscreen Black
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
May 13 05:02
Files Ready
May 13 05:02
Engineering Review Completed
May 21 11:16
Payment down
May 27 09:06
Production Started
May 27 09:16
Production Completed
Jun 11 14:20
Progress: 0/6
Engineering Review time: 8.3d Multiple File Revisions
Production time: 15.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.2 h
Carrier
DHL
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Jun 11 14:30

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Thick Copper Electroplating
05
Controlled Copper Etching
06
Solder Mask Application
07
Molten Solder Coating
08
Hot Air Leveling
09
Panelization Optimization
10
Batch AOI Inspection
11
Yield Control Management
12
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measures 245.59 × 304.79 mm with 1.6 mm thickness, TG150 material, and asymmetric copper weights of 1 oz inner/3 oz outer. Produced as 1×2 panels for a total of 2800 pieces using lead-free HASL surface finish, the order featured 0.3 mm minimum holes and 6 mil line/space. V-cut combined with routing defined the final separation, with black silkscreen and cold white solder mask applied over the heavier copper side.

 

DFM review addressed multiple manufacturability concerns. Narrow 0.2 mm slots in the thick copper area were impossible to produce reliably and required confirmation of adjusted dimensions. Silkscreen characters positioned half on copper and half on substrate risked breakage, while extremely small highlighted characters exceeded process capability for clear readability. Drill layer counts did not match the provided hole data, V-cut lines intersected critical features, and non-standard solder mask thickness needed agreement for process control. Tolerance adjustments on slots and stamp hole configurations were also aligned before release.

 

All clarifications were resolved prior to production, allowing consistent execution of the heavy copper PCB layout and HASL thickness consistency across the large batch. Engineering test fixtures verified electrical performance, and the full quantity shipped within the 11-day window with complete test reports and quality documentation. Final boards met dimensional and functional requirements with no impact from the resolved DFM points.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail

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