4 Layer FR4 PCB Production Record #FR4-20260918-083

This order comprised ten panels of standard 4-layer FR4 circuit, each measuring 98 × 25 mm and built to 1.6 mm thickness with a custom stackup. The design used 1 oz copper weight, conventional 6/6 mil trace and spacing, and 0.3 mm minimum hole size. Green soldermask, white silkscreen, and HASL Lead Free surface finish were selected to match standard assembly requirements without impedance control or blind vias.

We performed engineering review and material preparation, followed by inner layer imaging, circuit etching, layer stack alignment, and high pressure lamination to form the multilayer construction. Solder mask application preceded molten solder coating and hot air leveling, producing a uniform HASL Lead Free surface. Electrical testing then confirmed continuity and isolation across all panels.

The full run completed in 2.5 days and delivered consistent panel quality within specified tolerances. The straightforward parameters and panel format allowed steady process flow from lamination through final testing, resulting in reliable boards ready for customer use.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→