4 Layer FR4 PCB Production Record #FR4-20261022-008

This order comprised five standard 4-layer FR4 boards, each measuring 22 × 52.6 mm with 1.6 mm finished thickness and 1 oz copper on all layers. The design used a default stackup without blind vias or impedance control and specified 6/6 mil minimum trace width and spacing along with 0.3 mm minimum hole size. After engineering review and material preparation, inner layer imaging, circuit etching, layer alignment, and high-pressure lamination were performed in sequence to maintain registration across the multilayer construction.

Green soldermask and white silkscreen were applied prior to molten solder coating and hot air leveling, producing a uniform HASL Lead Free surface finish suitable for straightforward assembly. All five boards completed the full process flow including electrical testing within a 4.1-day window. The conventional parameters allowed standard production methods while still requiring exacting control during lamination and surface coating to ensure consistent copper thickness and reliable through-hole connections.

Every board passed final testing with no rework required, confirming that the chosen parameters translated directly into functional multilayer boards ready for immediate use. This small-quantity run illustrates steady execution for standard 4-layer FR4 PCB orders finished with HASL Lead Free.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→