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10+ Layer HDI PCB Production Record #HDI-20260327-0001

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 5 pcs
Layers 18 Layers Board Type Panel PCB
Dimensions 124 x 202 mm Copper Weight 1oz
Thickness 2 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Matte Black Silkscreen White
HDI Structure 3 Blind/Buried Vias Yes

Manufacturing Timeline

Order Created
Nov 24 13:16
Files Ready
Nov 24 13:16
Engineering Review Completed
Nov 24 15:15
Payment down
Nov 24 15:19
Production Started
Nov 24 15:19
Production Completed
Dec 10 21:24
Progress: 0/6
Engineering Review time: 2h
Production time: 16.3d

Logistics Information

Production Completed→Shipping : 0.7d
Carrier
FedEx IP
Destination
TURKEY
Shipping Method
Express Air
Shipping Time
Dec 11 15:24

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Sequential Lamination
10
Laser Microvia Drilling
11
Via Filling & Plating
12
Solder Mask Application
13
Electroless Nickel Deposition
14
Immersion Gold Deposition
15
TDR Impedance Testing
16
Electrical Testing

Manufacturing Summary

This 18-layer HDI panel PCB order required a custom stackup to accommodate its 3-step blind via structure, 3/3 mil minimum trace and spacing, and 0.1 mm holes. Produced in a quantity of five boards measuring 124 × 202 mm with 2 mm finished thickness and 1 oz copper, the design demanded exact layer registration and sequential lamination to maintain signal integrity across the impedance controlled layers.

 

We performed laser microvia drilling, via filling and plating, followed by matte black solder mask and immersion gold ENIG surface finish. Trace width compensation was applied during inner layer imaging and etching to achieve the tight geometries. TDR impedance testing at multiple points confirmed that the finished panels met the specified tolerances, while full electrical testing verified net continuity and isolation.

 

The 16-day production window allowed thorough verification at each sequential lamination stage, resulting in consistent electrical performance and dimensional stability across all delivered panels. The completed impedance controlled HDI PCBs reflect the process controls required for this advanced multilayer configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260720-0001 HDI PCB 8 188 x 100 Matte Black ENIG (Immersion Gold) 125 View detail
HDI-20260718-0002 HDI PCB 4 37 x 26.6 Green ENIG (Immersion Gold) 20 View detail
HDI-20260717-0002 HDI PCB 8 137.8 x 100.5 Matte Black ENIG (Immersion Gold) 200 View detail

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