2 Layer Rogers PCB Production Record #ROG-20260310-047
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rogers PCB | Quantity | 15 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 35.6 x 120.7 mm | Copper Weight | 1oz |
| Thickness | 0.254 mm | Min Track / Spacing | 8/8mil↑ |
| Surface Finish | Immersion Silver | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | White |
| Material Type | Rogers/RO4350B |
This 2-layer Rogers board measured 35.6 × 120.7 mm with 0.254 mm thickness and used Rogers RO4350B material. Produced as 15 single pieces, the order featured 1 oz copper, immersion silver surface finish, green solder mask on the top side only, and white silkscreen. Minimum holes were 0.25 mm with 8 mil line/space, and the 14-day schedule included 100% flying probe testing on the thin Rogers construction.
DFM review addressed material appearance and feature risks. Absence of bottom-side solder mask on the Rogers laminate would allow natural yellowing of the base material; this was confirmed as acceptable. Copper pours and pads located too close to the board outline risked exposed copper after routing; the original design was followed with awareness of limited edge exposure. Marking addition was required, yet existing mask windows were oversized and would place the mark on the surface; placement was confirmed. Several vias sat inside IC pads, which would leave incomplete or voided pads after processing and elevate solder-joint risk; resin plugging was evaluated as a possible solution. Inner slot sizes between GM and GM4 layers were inconsistent and required alignment.
Confirmed material acceptance, edge treatments, and via-in-pad decisions were implemented prior to production. The thin Rogers boards achieved consistent immersion silver coverage and mechanical integrity within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the high-frequency material and dimensional requirements.
Discover how AIVON manufactures 2 Layer Rogers PCBs, including high-frequency material processing, dielectric performance control, RF application requirements, manufacturing challenges, and real production experience from customer orders.
Master troubleshooting common Rogers PCB manufacturing challenges including drilling defects, plating adhesion, delamination, and CTE mismatch. Learn practical solutions, process adjustments, and DFM tips to improve yield for high-frequency RO4000, RO4350B, and PTFE-based boards.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| ROG-20260527-071 | Rogers PCB | 2 | 81.7 x 81.7 | None | ENIG (Immersion Gold) | 15 | View detail |
| ROG-20260527-072 | Rogers PCB | 2 | 542.5 x 62.5 | None | ENIG (Immersion Gold) | 15 | View detail |
| ROG-20260331-008 | Rogers PCB | 2 | 86 x 57.7 | Green | ENIG (Immersion Gold) | 50 | View detail |
