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2 Layer Rogers PCB Production Record #ROG-20260321-048

Rogers PCB 2 Layers ENIG (Immersion Gold) RO4350B Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Rogers PCB Quantity 25 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 103.93 x 43.99 mm Copper Weight 1oz
Thickness 0.762 mm Min Track / Spacing 10/10mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.4mm
Solder Mask Green Silkscreen Black
Material Type Rogers/RO4350B

Manufacturing Timeline

Order Created
Feb 27 16:59
Files Ready
Feb 27 16:59
Engineering Review Completed
Feb 27 17:40
Payment down
Mar 03 17:08
Production Started
Mar 03 17:09
Production Completed
Mar 20 17:46
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 17.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
FedEx IP
Destination
SPAIN
Shipping Method
Express Air
Shipping Time
Mar 21 18:21

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Rogers Material Preparation
04
Circuit Imaging & Etching
05
Low Loss Material Lamination
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Electrical Testing

Manufacturing Summary

This production record covers 25 panels of 2-layer Rogers RO4350B material, each measuring 103.93 × 43.99 mm with 0.762 mm thickness and 1 oz copper. The design uses a conventional 10/10 mil trace and spacing geometry together with 0.4 mm minimum holes. Green solder mask and black silkscreen were applied to deliver high contrast, while immersion gold ENIG surface finish was selected to provide stable contact resistance and long-term solderability on the low-loss substrate.

 

Rogers material preparation and low loss material lamination steps received particular focus to protect the dielectric constant and minimize thickness variation. Circuit imaging and etching produced clean features without undercutting, after which solder mask application, electroless nickel deposition, and immersion gold deposition were sequenced under controlled parameters. Every panel completed full electrical testing to confirm net continuity and isolation before release.

 

The 17.1-day manufacturing cycle yielded panels with repeatable dimensional stability and surface quality suited for RF applications. Execution of these processes ensured the finished Rogers PCBs met the customer's requirements for consistent performance and reliable delivery.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
ROG-20260527-071 Rogers PCB 2 81.7 x 81.7 None ENIG (Immersion Gold) 15 View detail
ROG-20260527-072 Rogers PCB 2 542.5 x 62.5 None ENIG (Immersion Gold) 15 View detail
ROG-20260331-008 Rogers PCB 2 86 x 57.7 Green ENIG (Immersion Gold) 50 View detail

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