2 Layer Aluminum PCB Production Record #ALU-20250803-0042

These 20 aluminum boards were produced as individual boards measuring 30.1 × 49.91 mm with 1.6 mm total thickness, 1 oz copper, and 1.0W thermal conductivity. The 2-layer stack-up required precise metal base preparation and thermal insulation lamination to deliver both AC 3000V isolation and effective heat transfer. With a standard 10/10 mil track spacing and minimum 1.5 mm hole size, the design presented conventional geometry that allowed stable etching and drilling while maintaining the aluminum substrate's thermal performance.

White solder mask and black silkscreen were applied after circuit imaging and etching. The HASL Lead Free surface finish was formed through molten solder coating and hot air leveling, yielding a flat, uniform coating compatible with the aluminum core. Heat dissipation control was monitored at each thermal stage to prevent warping or delamination, ensuring the finished boards retained their designed conductivity and mechanical stability.

Electrical testing verified voltage withstand and continuity on every board. The full sequence from engineering review through final inspection was completed in 4.1 days, producing a consistent set of aluminum PCBs that meet the customer's thermal and high-voltage requirements.