PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Aluminum PCB | Quantity | 5 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 10 x 10.6 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | HASL Lead Free | Min Hole Size | 1.5mm↑ |
| Solder Mask | White | Silkscreen | None |
| Thermal Conductivity | 2.0W | Voltage Withstand | AC2500V |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers five 2-layer aluminum PCBs with a thermal conductivity of 2.0W. Each board measures 10 x 10.6 and has a thickness of 1.6mm with 1oz copper layers. The specifications include 10/10 mil track and spacing, minimum hole size of 1.5mm, white soldermask with no silkscreen, HASL Lead Free finish, and AC2500V voltage withstand capability.
We conducted metal base preparation and thermal insulation lamination to secure the dielectric layer and optimize heat transfer. Circuit imaging and etching created the required traces on the aluminum PCB, followed by solder mask application, molten solder coating, and hot air leveling. Heat dissipation control was maintained throughout these steps to meet the thermal performance criteria.
All boards underwent electrical testing to verify integrity and compliance with the design parameters. The full manufacturing sequence from initial engineering review to completion extended over 10.1 days, yielding consistent results for this low-volume aluminum PCB order focused on effective thermal management.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| ALU-20260727-042 | Aluminum PCB | 2 | 30.1 x 49.91 | White | HASL Lead Free | 120 | View detail |
| ALU-20260715-003 | Aluminum PCB | 1 | 482 x 44 | Black | HASL Lead Free | 5 | View detail |
| ALU-20260531-057 | Aluminum PCB | 1 | 378.5 x 220.5 | Black | HASL Lead Free | 125 | View detail |
