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HASL Aluminum PCB Production Record #ALU-20251013-0014

Start Aluminum PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Aluminum PCB Quantity 10 pcs
Layers 1 Layers Board Type Panel PCB
Dimensions 80 x 1100 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 10/10mil
Surface Finish HASL Lead Free Min Hole Size 1.5mm↑
Solder Mask White Silkscreen Black
Thermal Conductivity 1.0W Voltage Withstand AC2500V

Manufacturing Timeline

Order Created
Sep 23 09:52
Files Ready
Sep 23 09:52
Engineering Review Completed
Sep 23 10:23
Payment down
Sep 23 20:01
Production Started
Sep 23 20:04
Production Completed
Sep 30 09:39
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 6.6d

Logistics Information

Production Completed→Shipping : 13.3d
Carrier
FedEx IP
Destination
ARGENTINA
Shipping Method
Express Air
Shipping Time
Oct 13 16:14

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Metal Base Preparation
04
Circuit Imaging & Etching
05
Thermal Insulation Lamination
06
Solder Mask Application
07
Molten Solder Coating
08
Hot Air Leveling
09
Heat Dissipation Control
10
Electrical Testing

Manufacturing Summary

This aluminum PCB production run consisted of 10 long-format panels measuring 80 × 1100 mm. The single-layer boards were built on 1.6 mm thick aluminum base with 1.0W thermal conductivity, 1 oz copper, 10/10 mil track spacing, and minimum hole size of 1.5 mm. White soldermask, black silkscreen, and HASL Lead Free surface finish were applied to support efficient heat dissipation combined with AC2500V voltage withstand capability. These parameters required precise control during lamination to maintain flatness across the extended panel length while preserving thermal performance.

 

Manufacturing followed a sequence of metal base preparation, circuit imaging and etching, thermal insulation lamination, and solder mask application. Molten solder coating and hot air leveling were executed to ensure uniform coating thickness on the large panels. Heat dissipation control steps were integrated after lamination to stabilize material stresses, followed by electrical testing that verified isolation integrity and continuity on every board.

 

The entire order was completed in 6.6 days with stable process parameters. Resulting panels showed consistent solderability and thermal characteristics suitable for linear high-power assemblies.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
ALU-20260727-042 Aluminum PCB 2 30.1 x 49.91 White HASL Lead Free 120 View detail
ALU-20260715-003 Aluminum PCB 1 482 x 44 Black HASL Lead Free 5 View detail
ALU-20260531-057 Aluminum PCB 1 378.5 x 220.5 Black HASL Lead Free 125 View detail

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