2 Layer Aluminum PCB Production Record #ALU-20251022-0084

This production record covers five 2-layer aluminum PCBs measuring 50 × 80 mm with 1.6 mm total thickness, 1 oz copper, and 1.0 W/mK thermal conductivity. The design used a standard 10/10 mil trace and spacing geometry together with 1.5 mm minimum holes, blue soldermask, white silkscreen, and HASL Lead Free finish. An AC 3000 V withstand rating was specified, requiring particular attention to dielectric integrity and thermal interface quality during the aluminum substrate processing.

Material preparation began with metal base cleaning and sizing, followed by circuit imaging, etching, and thermal insulation lamination to bond the dielectric layer. Solder mask application, molten solder coating, and hot air leveling produced a uniform HASL Lead Free surface. Heat dissipation control steps were maintained throughout to preserve the 1.0 W thermal path, while electrical testing verified the 3000 V isolation on every board.

The small batch was completed in 18.7 days with consistent results across all five pieces. Each board met both the thermal conductivity target and high-voltage requirement, confirming reliable performance for heat-generating applications.