PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 1000 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 15.5 x 18 mm | Copper Weight | 1/3OZ |
| Thickness | 0.13 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | PI Stiffener |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this order of 2-layer flex boards, production encompassed 1000 boards with dimensions of 15.5 x 18 mm and a finished thickness of 0.13 mm. Constructed with 1/3 oz rolled copper and polyimide material, the circuits incorporated PI stiffeners along with a yellow soldermask, white silkscreen, and ENIG immersion gold surface finish. These elements demanded accurate lamination and plating sequences to maintain the required bend characteristics.
We handled the polyimide substrate with specific protocols to ensure flatness throughout processing. Circuit imaging and etching achieved the 6/6 mil geometry, after which coverlay lamination and solder mask application were performed. Subsequent electroless nickel and immersion gold deposition steps created durable contact surfaces. Dynamic flex testing integrated with AOI and electrical testing confirmed that all units met specifications.
Completed within 9.5 days, the run delivered consistent results suited to the demands of flexible circuit applications.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260821-065 | Flexible PCB | 4 | 111.25 x 16.75 | Yellow | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260819-026 | Flexible PCB | 4 | 59.8 x 65.5 | Yellow | ENIG (Immersion Gold) | 25 | View detail |
| FPC-20260810-032 | Flexible PCB | 4 | 357 x 45.8 | Black | ENIG (Immersion Gold) | 1000 | View detail |
