2 Layer Flexible PCB Production Record #FPC-20260130-059

This manufacturing run involved 1000 units of a 2-layer flexible PCB. Each board measured 26.25 x 10.5 mm and featured an ultra-thin 0.13 mm profile using 1/3 oz rolled copper on polyimide material. PI stiffeners were selectively applied to provide localized support, complemented by yellow soldermask, white silkscreen, and immersion gold ENIG finish. The 6/6 mil track spacing and 0.25 mm minimum hole size followed standard flexible PCB geometry, yet the thin construction required careful process management for dimensional accuracy and layer registration.

In production, polyimide material handling received close attention to avoid wrinkling or stretching during lamination and etching stages. Coverlay application was executed prior to the solder mask and surface finish sequences, where electroless nickel and immersion gold were deposited under controlled conditions. Dynamic flex testing confirmed the circuits' ability to endure repeated bending cycles without performance degradation, supported by comprehensive AOI and electrical testing across the entire batch.

The 7.5-day production delivered reliable flexible circuits exhibiting uniform quality and performance characteristics suitable for precision applications.