2 Layer Flexible PCB Production Record #FPC-20260130-060

This production run delivered 1000 pieces of 2-layer flexible PCBs measuring 7.5 × 20 mm with a total thickness of 0.13 mm. The construction used 1/3 oz rolled copper on polyimide material, PI stiffeners in select areas, yellow soldermask, white silkscreen, and immersion gold ENIG finish. Minimum 6/6 mil geometry and 0.25 mm hole size were maintained throughout, presenting a combination of thin profile, light copper weight, and flex-specific requirements that demanded exact process control from material preparation onward.

Polyimide material handling and coverlay lamination received particular attention to preserve dimensional stability and flexibility. Circuit imaging and etching were followed by solder mask application, then electroless nickel and immersion gold deposition to form reliable pad surfaces. Dynamic flex testing was performed on sample boards from the batch to confirm bending endurance, while the overall sequence respected the material limits of this thin flexible PCB design.

Batch AOI inspection and full electrical testing confirmed consistent trace integrity and surface quality across all 1000 boards. The order completed in 7.5 days, producing flexible circuits that performed reliably within the stated specifications and mechanical constraints.