Single Layer Flexible PCB Production Record #FPC-20260203-035

This production run delivered 5000 single-layer flexible circuit boards built on 0.1 mm polyimide with 1/2 oz rolled copper. Boards measured 20.05 × 17.5 mm and carried 3/3 mil minimum trace and spacing, black solder mask, immersion gold ENIG surface finish, and PI stiffeners at reinforcement points. The ultra-thin profile combined with fine geometry and dynamic flex requirements shaped every stage from material preparation to final validation.

Polyimide material handling prevented wrinkles and contamination on the delicate substrate. Circuit imaging and etching defined the fine conductors, followed by coverlay lamination, selective black solder mask application, and the full ENIG plating sequence of electroless nickel deposition and immersion gold deposition. Dynamic flex testing, batch AOI inspection, and electrical testing confirmed mechanical endurance and electrical integrity across the entire lot.

Completed in 5.2 days, the order maintained stable dimensional and plating consistency, resulting in reliable flexible circuits suited for compact, high-flex applications.