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Single Layer Flexible PCB Production Record #FPC-20260209-058

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 1000 pcs
Layers 1 Layers Board Type Single PCB
Dimensions 79.37 x 6.35 mm Copper Weight 1/2OZ
Thickness 0.1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask None Silkscreen White
Material Rolled Copper Stiffener None
Blind/Buried Vias No

Manufacturing Timeline

Order Created
Jan 21 11:26
Files Ready
Jan 21 11:34
Engineering Review Completed
Jan 21 12:13
Payment down
Jan 26 20:14
Production Started
Jan 26 20:16
Production Completed
Jan 31 18:37
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 5.0d

Logistics Information

Production Completed→Shipping : 8.9d
Carrier
DHL
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Feb 09 15:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Circuit Imaging & Etching
05
Coverlay Lamination
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Dynamic Flex Testing
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This production record covers 1000 single-layer flexible PCBs built on 0.1 mm polyimide with rolled copper at 1/2 oz weight. Each board measures 79.37 × 6.35 mm, creating a long, narrow strip format with 0.3 mm minimum hole size and standard 6/6 mil trace spacing. No soldermask or stiffener was applied; instead, white silkscreen and immersion gold ENIG surface finish were specified on exposed copper. The thin construction and flexible material required controlled polyimide handling and imaging to maintain flatness and registration throughout etching.

 

Coverlay lamination followed circuit definition to protect conductors while leaving pads open for plating. Electroless nickel deposition and immersion gold plating were completed in sequence, after which each panel underwent dynamic flex testing to confirm bend endurance. Batch AOI inspection, electrical testing, and yield tracking verified uniformity across the full quantity. The five-day schedule kept all process steps aligned without deviation from the specified parameters.

 

The completed flexible circuits exhibited consistent trace definition and plating adhesion, supporting reliable performance in the intended application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

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