Single Layer Flexible PCB Production Record #FPC-20260304-056

This production record details 510 single-layer flex PCBs built on 0.13 mm rolled copper polyimide material. The panels measure 12 × 385 mm and include FR4 stiffeners in select zones, yellow soldermask, black silkscreen, and immersion gold ENIG surface finish. The narrow, elongated format and thin cross-section demanded precise material handling to maintain dimensional stability and avoid wrinkling during all processing stages.

Circuit imaging and etching produced the required 6/6 mil traces on the flexible substrate, followed by coverlay lamination and yellow solder mask application. Electroless nickel and immersion gold deposition created a reliable ENIG finish. Dynamic flex testing verified mechanical endurance under repeated bending, while batch AOI inspection and full electrical testing confirmed electrical continuity across the entire lot.

Completed over 7 days, the run delivered consistent board-to-board performance with all panels meeting the specified thickness, hole size, and surface requirements. The resulting flexible circuits provide dependable operation for applications needing both controlled flexibility and stable conductivity.