Single Layer Flexible PCB Production Record #FPC-20260306-092

This production record covers 50 1 layer flexible PCBs built on 0.1 mm polyimide material with 1/3 oz rolled copper. The long, narrow 28.5 × 350 mm format, combined with yellow solder mask, white silkscreen, PI stiffeners, and immersion gold ENIG finish, defined the manufacturing approach. At this thickness the material is prone to wrinkling, so polyimide handling procedures were adjusted from the start to preserve flatness and copper adhesion across the entire length.

Circuit imaging and etching maintained the 6/6 mil geometry without deviation. Coverlay lamination, solder mask application, electroless nickel deposition, and immersion gold plating followed in sequence. Dynamic flex testing was performed to confirm the circuits could endure repeated bending at the intended radii, while 100 % electrical testing verified isolation and continuity on every board.

The complete run was delivered after 10 days with uniform surface quality and stiffener alignment. These process controls produced flexible circuits that met both mechanical endurance and soldering requirements for the customer's PCB assembly line.