2 Layer Flexible PCB Production Record #FPC-20260311-042

This order involved the production of 500 units of 2-layer flexible boards using rolled copper on a 0.2 mm polyimide base. With dimensions of 110 by 64.96 mm, the design incorporated a minimum trace width and spacing of 6 mil, along with drilled holes no smaller than 0.3 mm. Material preparation and polyimide handling received particular attention to maintain the substrate's flexibility while achieving precise circuit imaging and etching.

We applied coverlay lamination followed by yellow solder mask and white legend printing. FR4 stiffeners were added to critical zones for component stability. The immersion gold ENIG surface finish was deposited to provide reliable connectivity and protection. Dynamic flex testing confirmed the boards could withstand repeated bending cycles without performance degradation.

Throughout the 31.6-day manufacturing cycle, each panel underwent AOI inspection and electrical testing to verify compliance with specifications. The resulting flexible circuits demonstrated excellent consistency, delivering the expected mechanical and electrical performance for the customer's application.